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RF Lines

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Photonic Packaging Sourcebook

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Abstract

The wide use of integrated microwave and millimeter-wave circuits requires a packaging and interconnection technology, which keeps in mind on the one hand the specific circumstances of the case materials and on the other hand meets the special requirements of high-frequency connection to the chip. The necessary structures are typically implemented as microstrip line or coplanar line. For particularly high-frequency connections to more than 100-GHz semirigid coaxial cables are used. In this chapter, the basic principles of the coaxial and coplanar lines are represented.

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References

  • Eckhardt, T., Fischer, U.H.P., Ziegler, R.: DIL-size reusable modules with up to 50 GHz modulation bandwidth for optical communications systems. In: Faulkner, D.W., Harmer, A.L. (eds.) WDM and Photonic Networks, pp. 181–184. IOS Press, Netherlands (2000)

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Authors and Affiliations

  1. Photonic Communications Lab, Harz University of Applied Sciences, Friedrichstr. 57–59, 38855, Wernigerode, Germany

    Ulrich H. P. Fischer-Hirchert

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  1. Ulrich H. P. Fischer-Hirchert
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Correspondence to Ulrich H. P. Fischer-Hirchert .

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Fischer-Hirchert, U.H.P. (2015). RF Lines. In: Photonic Packaging Sourcebook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-25376-8_5

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  • DOI: https://doi.org/10.1007/978-3-642-25376-8_5

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-25375-1

  • Online ISBN: 978-3-642-25376-8

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