Photonic Packaging Sourcebook

Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

  • Ulrich H. P.¬†Fischer-Hirchert

Table of contents

  1. Front Matter
    Pages i-xix
  2. Ulrich H. P. Fischer-Hirchert
    Pages 1-21
  3. Ulrich H. P. Fischer-Hirchert
    Pages 23-55
  4. Ulrich H. P. Fischer-Hirchert
    Pages 57-76
  5. Ulrich H. P. Fischer-Hirchert
    Pages 77-109
  6. Ulrich H. P. Fischer-Hirchert
    Pages 111-131
  7. Ulrich H. P. Fischer-Hirchert
    Pages 133-147
  8. Ulrich H. P. Fischer-Hirchert
    Pages 149-165
  9. Ulrich H. P. Fischer-Hirchert
    Pages 167-192
  10. Ulrich H. P. Fischer-Hirchert
    Pages 193-216
  11. Ulrich H. P. Fischer-Hirchert, Ulrich Krzysztof Nieweglowski
    Pages 217-239
  12. Ulrich H. P. Fischer-Hirchert
    Pages 241-268
  13. Ulrich H. P. Fischer-Hirchert
    Pages 269-307
  14. Ulrich H. P. Fischer-Hirchert
    Pages 309-318
  15. Back Matter
    Pages 319-325

About this book

Introduction

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

Keywords

Adhesive bonding Coupling efficiency Fiber chip coupling Multi fiber coupling Optical communication systems Optical fiber profiles Optical motherboard Optical packaging design

Authors and affiliations

  • Ulrich H. P.¬†Fischer-Hirchert
    • 1
  1. 1.Photonics Communications LabHarz University of Applied SciencesWernigerodeGermany

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-642-25376-8
  • Copyright Information Springer-Verlag Berlin Heidelberg 2015
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Engineering
  • Print ISBN 978-3-642-25375-1
  • Online ISBN 978-3-642-25376-8
  • About this book
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