Reliability Tests

Abstract

At the end of the development of a module, the question about the stability of the fiber-chip coupling and electrical and mechanical stability always stands. The following test runs are essential to modules, which must be tested for the datacom industry (DUT, device under test): (1) Temperature cycles. (2) Test at high dampness and high temperature. (3) Mechanical oscillations. (4) Mechanical shock. The environmental influences on products and their effects are numerous and from most different kind. The necessity for device and component manufacturers to bring long-lived products on the market requires suitable examinations under operating conditions. The goals of the environmental checks are the uncovering of cause-and-effects connections, the qualification of environmental conditions and the optimization of a long-term-stable product development. With aging and decomposition processes and with reliability studies, one mostly uses time lapse and artificial aging. The tests are accomplished in suitable environmental simulators, whereby commercial climate chambers are available from interior of some liters up to 100 m² large areas for automobile tests. A typical climatic chamber with an interior of 200 L and a usable temperature range between −40 and +280 °C is represented in Fig. 13.1. Basis of the audits provides international testing standards. In the specific case, the stress values must be adapted to the standards, which manifests itself, e.g., in the different procedures of the various standards for telecommunications goods.