Abstract
Carbon nanotubes (CNTs) due their unique mechanical, thermal, and electrical properties are being investigated as promising candidate material for on-chip and off-chip interconnects. The attractive mechanical properties of CNTs, including high Young’s modulus, resiliency, and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for 3D integration. Through-Silicon-Vias (TSVs) enable 3D integration and implementation of denser, faster, and heterogeneous circuits, which also lead to excessive power densities and elevated temperatures. Due to their unique properties, CNTs present an opportunity to address these challenges and provide solutions for reliable power delivery networks in 2D and 3D integration. In this chapter, we perform detailed analyses of horizontally aligned CNTs and report on their efficiency to be exploited for both 2D and 3D power delivery networks.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Aliev AE, Lima MH, Silverman EM, Baughman RH (2010) Thermal conductivity of multi-walled carbon nanotube sheets: radiation losses and quenching of phonon modes. Nanotechnology. 21(3)
Burke PJ (2002) Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes. IEEE Trans Nanotechnol 1(3):129–144
Cassell AM, Kreupl F, Li H, Liu W, Banerjee K (2013) Low-resistivity long-length horizontal carbon nanotube bundles for interconnect applications - part ii characterization. IEEE Trans Electron Devices 60:2870–2876
Jiang J, Saito R, GrĂĽneis A, Chou SG, Ge Samsonidze G, Jorio A, Dresselhaus G, Dresselhaus MS (2005) Photoexcited electron relaxation processes in single-wall carbon nanotubes. Phys Rev B 71:045417
Jirahara K, Miyamoto Y, Ando Y, Qin L-C, Zhao X, Iijima S (2000) The smallest carbon nanotube. Nature 408(6808):50
Kane CL, Yao Z, Dekker C (2000) High-field electrical transport in single-wall carbon nanotubes. Phys Rev Lett 84(13):2941–2944
Khan NH, Hassoun S (2012) The feasibility of carbon nanotubes for power delivery in 3-d integrated circuits. In: 17th Asia and South Pacific design automation conference (ASP-DAC), pp 53–58
Leonard F, Talin AA(2006) Electrical contacts to nanotubes and nanowires: why size matters. Condens Matter. ArXiv e-prints. http://arxiv.org/abs/cond-mat/0602003
Li GD, Wang N, Tang ZK, Chen JS (2000) Single-walled carbon 4 a carbon nanotube arrays. Nature 408(6808):50–51
Li H, Srivastava N, Mao J-F, Yin W-Y, Banerjee K (2007) Carbon nanotube vias: a reality check. In: IEEE international electron devices meeting, 2007 (IEDM, 2007), pp 207–210
Li H, Xu C, Srivastava N, Banerjee K (2009) Carbon nanomaterials for next-generation interconnects and passives: physics, status, and prospects. IEEE Trans Electron Devices 56(9):1799–1821
Li H, Liu W, Cassell AM, Kreupl F, Banerjee K (2013) Low-resistivity long-length horizontal carbon nanotube bundles for interconnect applications 2014 - part ii - characterization. IEEE Trans Electron Devices 60(9):2870–2876
Naeemi A, Meindl JD (2007) Physical modeling of temperature coefficient of resistance for single- and multi-wall carbon nanotube interconnects. IEEE Electron Device Lett 28:135–138
Naeemi A, Sarvari R, Meindl JD (2005) Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI). IEEE Electron Device Lett 26(2):84–86
Naeemi A, Huang G, Meindl JD (2007) Performance modeling for carbon nanotube interconnects in on-chip power distribution. In: Electronic components and technology conference, pp 420–428
Nieuwoudt A, Massoud Y (2006) Evaluating the impact of resistance in carbon nanotube bundles for VLSI interconnect using diameter-dependent modeling techniques. IEEE Trans Electron Devices 53(10):2460–2466
Pop E, Mann D, Reifenberg J, Goodson K, Dai H (2005) Electro-thermal transport in metallic single-wall carbon nanotubes for interconnect applications. In: IEEE international electron devices meeting (IEDM), Technical Digest, pp 253–256
Rinzler AC, Smalley RE, Wildoeer JWG, Venema LC, Dekkler C (1998) Electronic structure of atomically resolved carbon nanotubes. Nature 391(6662):59–61
Aliev AE, Lima MH, Silverman EM, Baughman RH (2010) Thermal conductivity of multi-walled carbon nanotube sheets: radiation losses and quenching of phonon modes. Nanotechnology, IOP Publishing, 21(3):035709
Srivastava N, Banerjee K (2005) Performance analysis of carbon nanotube interconnects for VLSI applications. In: Proceedings of the 2005 IEEE/ACM international conference on computer-aided design, pp 383–390
Tu R, Cao J, Wang Q, Kim W, Javey A (2005) Electrical contacts to carbon nanotubes down to 1 nm in diameter. Appl Phys Lett 87(17):173101
Zhu L, Sun Y, Xu J, Zhang Z, Hess DW, Wong CP (2005) Aligned carbon nanotubes for electrical interconnect and thermal management, vol 1, pp 44–50
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2017 Springer International Publishing Switzerland
About this chapter
Cite this chapter
Todri-Sanial, A. (2017). Exploring Carbon Nanotubes for 3D Power Delivery Networks. In: Todri-Sanial, A., Dijon, J., Maffucci, A. (eds) Carbon Nanotubes for Interconnects. Springer, Cham. https://doi.org/10.1007/978-3-319-29746-0_10
Download citation
DOI: https://doi.org/10.1007/978-3-319-29746-0_10
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-29744-6
Online ISBN: 978-3-319-29746-0
eBook Packages: EngineeringEngineering (R0)