Carbon Nanotubes for Interconnects

Process, Design and Applications

  • Aida Todri-Sanial
  • Jean Dijon
  • Antonio Maffucci

Table of contents

  1. Front Matter
    Pages i-xii
  2. Process and Design

    1. Front Matter
      Pages 1-1
    2. Ahmet Ceyhan, Azad Naeemi
      Pages 3-36
    3. A. Srivastava, X. H. Liu, Y. M. Banadaki
      Pages 37-80
    4. Antonio Maffucci, Sergey A. Maksimenko, Giovanni Miano, Gregory Ya. Slepyan
      Pages 101-128
    5. Leonid V. Zhigilei, Richard N. Salaway, Bernard K. Wittmaack, Alexey N. Volkov
      Pages 129-161
  3. Applications

    1. Front Matter
      Pages 163-163
    2. Sten Vollebregt, Ryoichi Ishihara
      Pages 195-213
    3. Dominique Baillargeat, E. B. K. Tay
      Pages 215-245
    4. Wen-Yan Yin, Wen-Sheng Zhao, Wenchao Chen
      Pages 247-281
    5. Max Marcel Shulaker, Hai Wei, Subhasish Mitra, H.-S. Philip Wong
      Pages 315-333

About this book

Introduction

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects.  The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications.  Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry.  This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

  • Provides a single-source reference on carbon nanotubes for interconnect applications;
  • Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects;
  • Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.

Keywords

3D Integrated Circuits Carbon Nanotubes Carbon Nanotubes and Nanostructures Graphene Graphene Nanoribbon Interconnects On-chip Interconnect TSVs for 3D Integrated Circuits

Editors and affiliations

  • Aida Todri-Sanial
    • 1
  • Jean Dijon
    • 2
  • Antonio Maffucci
    • 3
  1. 1.CNRS-LIRMM/University of MontpellierMontpellierFrance
  2. 2.CEA LITENGrenobleFrance
  3. 3.University of Cassino and Southern LazioCassinoItaly

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-29746-0
  • Copyright Information Springer International Publishing Switzerland 2017
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-29744-6
  • Online ISBN 978-3-319-29746-0
  • About this book
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