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Application II: Solder Joints Under Temperature and Mechanical Load Cycles

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Solder Joint Reliability Assessment

Part of the book series: Advanced Structured Materials ((STRUCTMAT,volume 37))

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Abstract

The reliability of microelectronic packages and assemblies is established through reliability testing of the device. In a reliability test, assemblies with BGA solder joints are subjected to temperature cycles, as prescribed by reliability test standards (e.g. JEDEC 2000).

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Authors and Affiliations

  1. Faculty of Mechanical Engineering, Universiti Teknologi Malaysia, UTM Skudai, 81310, Skudai, Johor, Malaysia

    Mohd N. Tamin

  2. Department of Manufacturing and Materials, Kulliyyah of Engineering, International Islamic University Malaysia, 53100, Gombak, Kuala Lumpur, Malaysia

    Norhashimah M. Shaffiar

Authors
  1. Mohd N. Tamin
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  2. Norhashimah M. Shaffiar
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Correspondence to Mohd N. Tamin .

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Tamin, M.N., Shaffiar, N.M. (2014). Application II: Solder Joints Under Temperature and Mechanical Load Cycles. In: Solder Joint Reliability Assessment. Advanced Structured Materials, vol 37. Springer, Cham. https://doi.org/10.1007/978-3-319-00092-3_6

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