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Combining Architecture and Algorithm for Yield Enhancement and Fault Tolerance

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Defect and Fault Tolerance in VLSI Systems

Abstract

IC manufacturers have traditionally met customers’ demands for ever increasing chip processing capability by decreasing feature size. The alternative -- significantly increasing the chip area -- has thus far not been economically competitive, owing primarily to the low yield of larger circuit areas [1].

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References

  1. R.O. Carlson and C.A. Neugebauer, Future Trends in Wafer Scale Integration, Proc. IEEE, Vol. 74, No. 12 (1986).

    Google Scholar 

  2. H.T. Kung, Why Systolic Architectures?, Computer (IEEE) (January 1982).

    Google Scholar 

  3. J.J. Vaccaro, B.L. Johnson, and C.L. Nowacki, A Systolic Discrete Fourier Transform Using Residue Number Systems Over the Ring of Gaussian Integers, Proc. 1986 IEEE International Conference on Acoustics, Speech, and Signal Processing (ICASSP) (1986).

    Google Scholar 

  4. G.A. Doodlesack, M. Gray, B.L. Johnson, C.L. Nowacki, and J.J. Vaccaro, VLSI Chip Designs for QRNS-Based DFTs, Proc. 1987 International Symposium on Circuits and Systems (ISCS) (1987).

    Google Scholar 

  5. R.J. Cosentino, Concurrent Error Correction in Systolic Architectures, IEEE Trans. Computer-Aided Design, Vol. CAD-7, No. 1 (1988).

    Google Scholar 

  6. B.L. Johnson, E.A. Palo, R.J. Cosentino, and J.J. Vaccaro, The Residue Number System for VLSI Signal Processing, Proc. SPIE, Advanced Algorithms and Architectures for Signal Processing, Vol. 696 (1986).

    Google Scholar 

  7. H.L. Garner, The Residue Number System, IRE Trans. Elect. Comput., Vol. EC-8, No. 6 (1959).

    Google Scholar 

  8. F. Barsi and P. Maestrini, Error Correcting Properties of Redundant Residue Number Systems, IEEE Trans. Comput., Vol. C-22, No. 3 (1973).

    Google Scholar 

  9. D. Mandelbaum, Error Correction in Residue Arithmetic, IEEE Trans. Comput., Vol. C-21, No. 6 (1972).

    Google Scholar 

  10. R.W. Watson, “Error Detection and Correction and Other Residue-Interacting Operations in a Redundant Residue Number System,” Ph.D. Dissertation, Dept. of Elec. Engrg., University of California, Berkeley (1965).

    Google Scholar 

  11. M.B. Ketchen, Point Defect Yield Model for Wafer Scale Integration, IEEE Circuits and Devices Magazine, Vol. 1, No. 4 (1985).

    Google Scholar 

  12. H.K. Dicken, Demystifying ASIC Costs, VLSI Systems Design (1988).

    Google Scholar 

  13. R.J. Cosentino, Fault Tolerance in a Systolic Residue Arithmetic Processor Array, IEEE Trans. Comput., Vol. C-37, No. 7 (1988).

    Google Scholar 

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© 1989 Plenum Press, New York

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Cosentino, R.J., Johnson, B.L., Vaccaro, J.J. (1989). Combining Architecture and Algorithm for Yield Enhancement and Fault Tolerance. In: Koren, I. (eds) Defect and Fault Tolerance in VLSI Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-6799-8_7

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  • DOI: https://doi.org/10.1007/978-1-4615-6799-8_7

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4615-6801-8

  • Online ISBN: 978-1-4615-6799-8

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