Skip to main content

Probabilistic Analysis of Yield and Area Utilization of Reconfigurable Rectangular Processor Arrays

  • Chapter
Defect and Fault Tolerance in VLSI Systems

Abstract

The increase in the number of components on a single chip has forced the designers and manufacturers to consider carefully, the issues related to the reliability, yield and effective silicon area utilization. Several reconfiguration schemes have been suggested in the literature to make a chip fault-tolerant by adding redundancy at various logical and physical levels.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 84.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. I. Koren and M.A. Breuer, “On area and yield considerations for fault — tolerant VLSI processor arrays”, IEEE, Trans. Comp, Vol. C-33, pp. 21–27, Jan. 1984.

    Article  Google Scholar 

  2. I. Koren and D.K. Pradhan, “Introducing redundancy into VLSI designs for yield and performance enhancement”, Proc. International Symposium on Fault — Tolerant Computing, pp. 330–335, June 1985.

    Google Scholar 

  3. J.M. Dauglrton and B.K. Koenernann, “Cost tradeoffs in wafer-scale integration”, Proc. IEEE International Conference on Computer Design, pp. 88–93, Oct. 1984.

    Google Scholar 

  4. K. Iledlund and L. Snyder, “Systolic architecture — A wafer scale approach”, Proc. IEEE International Conference on Computer Design, pp. 604–610, Oct. 1981.

    Google Scholar 

  5. T.E. Mangir and A. Avizienis, “Fault-tolerant design for VLSI: Effect of inter- connect requirements on yield improvement of VLSI design”, IEEE Trans. (JornD., Vol. C-31, pp. 609–615, July 1982.

    Article  Google Scholar 

  6. T.E. Mangir, “Sources of failure and yield improvement for VLSI restrncturable interconnects for RVLSI and WSI: Part I-Sources of failure and yield improvement for VLSI”, Proc. IEEE, Vol. 72, pp. 690–708, June 1984.

    Article  Google Scholar 

  7. S.C. Seth and V.D. Agarwal, “Characterizing the LSI yield equation from the chip test data”, Proc. IEEE ICCC-82, pp. 556–559, Sept. 1982.

    Google Scholar 

  8. P. Frauzon,“Interconnect strategies for fault — tolerant 2D VLSI arrays”, Proc, Int. Cord. on Computer Design, pp 230–233, Oct. 1986.

    Google Scholar 

  9. A.L. Rosenberg, “The Diogenes approach to testable fault — Tolerant arrays of processors”, IEEE Trans. Comp., Vol. C-32, pp. 902–910, Oct. 1983.

    Article  Google Scholar 

  10. K.E. Batcher, “Design of a Massively Parallel Processor”, IEEE Trans. Comp, Vol. C-29, pp. 836–840, Sept. 1980.

    Article  Google Scholar 

  11. H. Cox, S. Gaiotti, A. Jain, R. Tio, K. Faddallah, M. Mlowany, B. Mandava, J. Rajski and N.C. Runrin, “A processing element for a Reconfigurable Massively Parallel Processor”, Proc. Canadian Conference on VLSI, pp. 241–246, Oct. 1987.

    Google Scholar 

  12. S. Pateras and J. Rajski, “Self-reconfigurable interconnection network for a fault — tolerant mesh-connected array of processors”, Electronics letters, Vol. 24, pp. 600–602, 12th May 1988.

    Article  Google Scholar 

  13. M.G. Sami and R. Stefanelli, “Reconfigurable architectures for VLSI processing arrays”, Proc. IEEE., Vol. 74, pp. 712–722, May 1986.

    Article  Google Scholar 

  14. C. Jesshope and L. Bentley, “Techniques for implementing two — dimensional wafer — scale processor arrays”, Proc. IEE, Vol. 134, pp. 87–92, March 1987.

    Google Scholar 

  15. J.H. Hwang and C.S. Raghavendra, “VLSI implementation of fault — tolerant systolic arrays”, Proc. IEEE International Conference on Computer Design, pp. 110–113, Oct. 1986.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 1989 Plenum Press, New York

About this chapter

Cite this chapter

Jain, A., Rajski, J. (1989). Probabilistic Analysis of Yield and Area Utilization of Reconfigurable Rectangular Processor Arrays. In: Koren, I. (eds) Defect and Fault Tolerance in VLSI Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-6799-8_24

Download citation

  • DOI: https://doi.org/10.1007/978-1-4615-6799-8_24

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4615-6801-8

  • Online ISBN: 978-1-4615-6799-8

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics