Abstract
This paper provides a survey of MCM substrate test techniques. Test techniques that are based on capacitance, resistance, electron beam, latent opens, time domain network analysis (TDNA) and RF resonator are discussed. In this paper, test techniques are applied to interconnect testing.
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© 1997 Springer Science+Business Media New York
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Swaminathan, M., Kim, B., Chatterjee, A., Zorian, Y. (1997). A Survey of Test Techniques for MCM Substrates. In: Zorian, Y. (eds) Multi-Chip Module Test Strategies. Frontiers in Electronic Testing, vol 7. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-6107-1_3
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DOI: https://doi.org/10.1007/978-1-4615-6107-1_3
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