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Multi-Chip Module Test Strategies

  • Book
  • © 1997

Overview

Editors:
  1. Yervant Zorian

    1. Logic Vision, Inc., USA

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Part of the book series: Frontiers in Electronic Testing (FRET, volume 7)

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Table of contents (14 chapters)

  1. Front Matter

    Pages 1-6
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  2. Introduction

    1. Fundamentals of MCM Testing and Design-for-Testability

      • Yervant Zorian, V. D. Agrawal
      Pages 7-14

  3. Die Level Testing

    1. Known Good Die

      • Larry Gilg, Y. Zorian
      Pages 15-25

  4. Substrate Testing

    1. A Survey of Test Techniques for MCM Substrates

      • Madhavan Swaminathan, Bruce Kim, Abhijit Chatterjee, Y. Zorian
      Pages 27-38

    2. Smart Substrate MCMs

      • Anne E. Gattiker, Wojciech Maly, Y. Zorian
      Pages 39-53

    3. Electron Beam Probing—A Solution for MCM Test and Failure Analysis

      • R. Schmid, R. Schmitt, M. Brunner, O. Gessner, M. Sturm, Y. Zorian
      Pages 55-63

  5. Module Level Test

    1. MCM Test Strategy Synthesis from Chip Test and Board Test Approaches

      • Andrew Flint, Y. Zorian
      Pages 65-76

    2. Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules

      • Najmi Jarwala, Y. Zorian
      Pages 77-86

    3. An Effective Multi-Chip BIST Scheme

      • Yervant Zorian, Hakim Bederr, V. D. Agrawal
      Pages 87-95

  6. MCM Test Applications

    1. Design-for-Test in a Multiple Substrate Multichip Module

      • Joel A. Jorgenson, Russell J. Wagner, Y. Zorian
      Pages 97-108

    2. A Test Methodology for High Performance MCMs

      • Thomas M. Storey, Bruce McWilliam, Y. Zorian
      Pages 109-118

  7. Module Level Diagnosis

    1. A Formalization of the IEEE 1149.1–1990 Diagnostic Methodology as Applied to Multichip Modules

      • Ken Posse, Y. Zorian
      Pages 119-125

    2. Multichip Module Diagnosis by Product-Code Signatures

      • P. Nagvajara, J. Lin, P. Nilagupta, C. Wang, Y. Zorian
      Pages 127-135

  8. Simulation Techniques for MCMs

    1. Simulation Techniques for the Manufacturing Test of MCMs

      • Mick Tegethoff, Tom Chen, Y. Zorian
      Pages 137-149

  9. MCM Test Economics

    1. Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die

      • Cynthia F. Murphy, Magdy S. Abadir, Peter A. Sandborn, Y. Zorian
      Pages 151-166

  10. Back Matter

    Pages 167-167
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Keywords

About this book

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs.
Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain.
Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Editors and Affiliations

  • Logic Vision, Inc., USA

    Yervant Zorian

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