Abstract
In the last chapter we presented a qualitative summary of some of the commonly used modeling approaches. We concluded that the unified approach as presented by authors provides an efficient and accurate modeling technique. However, the previous publications by the same authors limit the use of this technique to MIC and MMIC applications only. Since chip–chip interconnects resemble planar transmission lines, the unified approach can be used to effectively model these high-speed interconnects as well. Having laid the foundation for the use of the unified approach in the previous chapter, we now present its applicability in analyzing high-speed interconnects. In particular, we present a composite parameter extraction algorithm followed by models for transient analysis of these interconnects. The application of unified approach for more standard structures such as the microstrip and stripline-like interconnects is already explained in the available literature and is therefore not covered in this chapter. Rather we present the analysis of complex yet practical interconnect geometries that are used in Printed Circuit Board (PCB) and Multichip module (MCM) applications nowadays.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
B. Bhat, S.K. Koul, Unified approach to solve a class of strip and microstrip-like transmission lines. IEEE Trans. Microw. Theory Tech. 82(5), 679–686 (1982)
B. Bhat, S.K. Koul, Stripline-like Transmission Lines for Microwave Integrated Circuits (Wiley, New york, 1989)
R.E. Collin, Field Theory of Guided Waves (McGraw-Hill, New York, 1960)
H.E. Green, The numerical solution of some important transmission line problems. IEEE Trans. Microw. Theory Tech. 13(5), 676–692 (1965)
R. Crampagne, M. Ahmadpanah, J.L. Guiraud, A simple method for determining the green’s function for a large class of MIC lines having multilayered dielectric substrates. IEEE Trans. Microw. Theory Tech. 26(2), 82–87 (1978)
C. Paul, Analysis of Multiconductor Transmission Lines, 2nd edn. (Wiley, Hoboken, 2007)
T.C. Edwards, M.B. Steer, Foundations of Interconnect and Microstrip Design, 3rd edn. (Wiley, New York, 2001)
J. Fan et al., Signal integrity design for high-speed digital circuits: progress and directions. IEEE Trans. Electromagn. Compat. 52(2), 392–400 (2010)
E.-P. Li et al., Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects. IEEE Trans. Electromagn. Compat. 52(2), 248–265 (2010)
R. Sharma, T. Chakravarty, A.B. Bhattacharyya, Analytical modeling of microstrip-like interconnects in presence of ground plane aperture. IET Microw. Antennas Propag. 3(1), 14–22 (2009)
R. Sharma, T. Chakravarty, A.B. Bhattacharyya, Analytical model for optimum signal integrity in pcb interconnects using ground tracks. IEEE Trans. Electromagn. Compat. 51(1), 67–77 (2009)
T. Zhang, S.S. Sapatnekar, Simultaneous shield and buffer insertion for crosstalk noise reduction in global routing. IEEE Trans. VLSI Syst. 15(6), 624–636 (2007)
J. Zhang, E. G. Friedman, Crosstalk modeling for coupled RLC interconnects with application to shield insertion. IEEE Trans. VLSI Syst. 14(6), 641–646 (2006)
R. Simmons, Coplanar Waveguide Circuits, Components, and Systems, 1st edn. (Wiley-IEEE press, New York, 2001)
S.M. Musa, M.N.O. Sadiku, Capacitance and inductance matrices for multistrip lines. in Proceedings of the COMSOL Conference (2007)
N.D. Arora, Challenges of modeling VLSI interconnects in the DSM Era. in Proceedings of International Conference on Modeling and Simulation of Microsystems (2002), pp. 645–648
Y. Cao et al., Impact of on-chip interconnect frequency-dependent R(f)L(f) on digital and rf design. IEEE Trans. VLSI Syst. 13(1), 158–162 (2005)
Y.I. Ismail, E.G. Friedman, J.L. Neves, Equivalent elmore delay for RLC trees. IEEE Trans. CAD Integr. Circuits Syst. 19(1), 83–97 (2000)
Y.I. Ismail, E.G. Friedman, J.L. Neves, Equivalent elmore’s delay for RLC trees. in Proceedings of Design Automation Conference (1999), pp. 715–720
R. Sharma, T. Chakravarty, K. Choi, Fast and efficient extraction algorithm for high-speed interconnects with arbitrary boundaries. J. Supercomput. (in press). doi:10.1007/s11227-011-0713-2
I. Novak, B. Eged, L. Hatvani, Measurement and simulation of crosstalk reduction by discrete discontinuities along coupled PCB traces. IEEE Trans. Instrum. Meas. 43(2), 170–175 (1994)
S. K. Kim, C. C. Liu, L. Xue, S. Tiwari, Crosstalk attenuation with ground plane structures in three-dimensionally integrated mixed signal systems, IEEE MTT-S Symposium (2005), pp. 2155−2159
J.C. Coetzee, J. Joubert, Full-wave characterization of the crosstalk reduction effect of an additional grounded track introduced between two printed circuit tracks. IEEE Trans. Circuits Syst. 43(7), 553–558 (1996)
H. Ozaki, J. Ishii, Synthesis of a class of stripline filters. IRE Trans. Circuit Theory 5(2), 104–109 (1958)
M.K. Krage, G.I. Haddad, Characteristics of coupled microstrip transmission lines-I: Coupled-mode formulation of inhomogeneous lines, II: Evaluation of coupled line parameters. IEEE Trans. Microw. Theory Tech. 18(4), 217–222 (1970)
R. Pregla, Calculation of the Distributed Capacitance and Phase Velocities in Coupled Microstrip Lines by Conformal Mapping Techniques. AEÜ 26, 470–474 (1972)
T.G. Bryant, J.A. Weiss, Parameters of microstrip transmission lines and of coupled pairs of microstrip lines. IEEE Trans. Microw. Theory Tech. 16(12), 1021–1027 (1968)
L. Young, H. Sobol, Advances in Microwaves (Academic Press, New York, 1966)
H.G. Bergandt, R. Pregla, Calculation of even- and odd-mode capacitances parameters for coupled microstrips. AEÜ 26, 153–158 (1972)
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2012 The Author(s)
About this chapter
Cite this chapter
Sharma, R., Chakravarty, T. (2012). Compact Models for Novel Interconnects Using Unified Approach. In: Compact Models and Measurement Techniques for High-Speed Interconnects. SpringerBriefs in Electrical and Computer Engineering(). Springer, Boston, MA. https://doi.org/10.1007/978-1-4614-1071-3_3
Download citation
DOI: https://doi.org/10.1007/978-1-4614-1071-3_3
Published:
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4614-1070-6
Online ISBN: 978-1-4614-1071-3
eBook Packages: EngineeringEngineering (R0)