Abstract
Methods for the modeling and analysis of substrate noise coupling in mixed signal integrated circuits are presented. The physical phenomena responsible for the creation of the undesired signals as well as the transmission mechanisms and media are described. Modeling and analysis techniques to quantify the noise coupling phenomena are presented. A computer-aided design methodology based on the modeling approaches and developed for the analysis and design of noise coupling in mixed-signal integrated circuits is described.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
G.H. Warren and C. Jungo, “Noise, crosstalk and distortion in mixed analog/digital integrated circuits,” Proc. of the IEEE Custom Integrated Circuits Conference, pp. 12.1.1–12.1.4., May 1988.
B.J. Hosticka and W. Brockherde, “The art of analog circuit design in a digital VLSI world,” Proc. of the IEEE International Symposium on Circuits and Systems, pp. 1347–1350, April 1990.
D.J. Allstot, S. Kiaei, and R.H. Zele, “Analog logic techniques steer around the noise,” IEEE Circuits and Devices Magazine, vol. 9, pp. 18–21, Sept. 1993.
N.K. Verghese, T.J. Schmerbeck and D.J. Allstot, Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits, Kluwer Academic Publishers, 1995.
N.K. Verghese, “Extraction and Simulation Techniques for Substrate-Coupled Noise in Mixed-Signal Integrated Circtuits”, Ph.D. Dissertation, Carnegie Mellon University, 1995.
E. Charbon, P. Miliozzi, L.P. Carloni, A. Ferrari and A. Sangiovanni-Vincentelli, “Modeling Digital Substrate Noise Injection in Mixed-Signal IC’s”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 18, no. 3, March 1999.
SeismIC User’s Guide, Cadence Design Systems, 2002.
Medici User’s Guide, Avanti Corporation.
Assura RCX User’s Guide, Cadence Design Systems, 2002.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2004 Kluwer Academic Publishers
About this chapter
Cite this chapter
Verghese, N., Chu, W.K., McCanny, J. (2004). Modeling and Analysis of Substrate Noise Coupling in Mixed-Signal ICs. In: Donnay, S., Gielen, G. (eds) Substrate Noise Coupling in Mixed-Signal ASICs. Springer, Boston, MA. https://doi.org/10.1007/0-306-48170-7_3
Download citation
DOI: https://doi.org/10.1007/0-306-48170-7_3
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4020-7381-6
Online ISBN: 978-0-306-48170-3
eBook Packages: Springer Book Archive