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Substrate Noise Coupling in Mixed-Signal ASICs

  • Book
  • © 2003

Overview

Editors:
  1. Stéphane Donnay

    1. IMEC, Leuven, Belgium

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  2. Georges Gielen

    1. Katholieke Universiteit, Leuven, Belgium

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Table of contents (13 chapters)

  1. Front Matter

    Pages i-xxxi
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  2. Technology Impact on Substrate Noise

    • Francois J. R. Clément
    Pages 1-21

  3. Substrate Noise Generation in Complex Digital Systems

    • Stéphane Donnay, Marc van Heijningen, Mustafa Badaroglu
    Pages 23-45

  4. Modeling and Analysis of Substrate Noise Coupling in Mixed-Signal ICs

    • Nishath Verghese, Wen Kung Chu, Jim McCanny
    Pages 47-63

  5. SPACE for Substrate Resistance Extraction

    • N. P. van der Meijs
    Pages 65-92

  6. Models and Parameters for Crosstalk Simulation

    • Valentino Liberali
    Pages 93-112

  7. High-Level Simulation of Substrate Noise Generation in Complex Digitlal Systems

    • Mustafa Badaroglu, Marc van Heijningen, Stéphane Donnay
    Pages 113-133

  8. Modeling the Impact of Digital Substrate Noise on Analog Integrated Circuits

    • Yann Zinzius, Georges Gielen, Willy Sansen
    Pages 135-160

  9. Measuring and Modeling the Effects of Substrate Noise on the LNA for a CMOS GPS Receiver

    • Min Xu, Bruce A. Wooley
    Pages 161-187

  10. A Practical Approach to Modeling Silicon-Crosstalk in Systems-on-Silicon

    • Paul T. M. van Zeijl
    Pages 189-208

  11. The Reduction of Switching Noise Using CMOS Current Steering Logic

    • Maher Kayal, Richard Lara Saez, Marc Pastre
    Pages 209-232

  12. Low-Noise Digital Design Techniques

    • Mustafa Badaroglu, Stéphane Donnay
    Pages 233-255

  13. How to Deal with Substrate Bounce in Analog Circuits in Epi-Type CMOS Technology

    • Bram Nauta, Gian Hoogzaad
    Pages 257-269

  14. Reducing Substrate Bounce in CMOS RF-Circuitry

    • Domine M. W. Leenaerts
    Pages 271-287
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Keywords

About this book

This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.

Reviews

From the reviews:

"This book covers modeling and simulation for the noise from substrate. This book reviews the causes of noise in substrate and possible prevention of the noise. … As a practicing engineer, I feel that their techniques for noise prevention are legitimate and applicable. This book is worthwhile for IC design engineers. Those engineers that work on integration of analog and digital parts may want to read this book to prevent any malfunctioning ICs." (IEEE Circuits & Devices Magazine, Vol. 20 (5), September/October, 2004)

Editors and Affiliations

  • IMEC, Leuven, Belgium

    Stéphane Donnay

  • Katholieke Universiteit, Leuven, Belgium

    Georges Gielen

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