Abstract
We will discuss the use of guard rings as a mean to reduce the effects of substrate bounce in a mixed-signal IC. Measurements have been performed on lightly and heavily doped substrates in several CMOS technologies. Furthermore, we will show some of the problems of substrate bounce in RF applications where the substrate bounce is caused by digital circuitry.
Philips Research Laboratories
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© 2004 Kluwer Academic Publishers
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Leenaerts, D.M.W. (2004). Reducing Substrate Bounce in CMOS RF-Circuitry. In: Donnay, S., Gielen, G. (eds) Substrate Noise Coupling in Mixed-Signal ASICs. Springer, Boston, MA. https://doi.org/10.1007/0-306-48170-7_13
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DOI: https://doi.org/10.1007/0-306-48170-7_13
Publisher Name: Springer, Boston, MA
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