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RF/Microwave Hybrids

Basics, Materials and Processes

  • Richard Brown

Table of contents

  1. Front Matter
    Pages i-xv
  2. Pages 1-4
  3. Pages 5-11
  4. Pages 13-27
  5. Pages 55-92
  6. Pages 93-111
  7. Pages 113-121
  8. Pages 123-127
  9. Pages 129-140
  10. Pages 141-142
  11. Pages 143-167
  12. Pages 169-184
  13. Pages 185-193
  14. Pages 195-228
  15. Pages 229-255
  16. Pages 257-268
  17. Back Matter
    Pages 271-283

About this book

Introduction

In 1991 this author published a monograph[l] based on his experience teaching microwave hybrid materials and processing technology at the annual ISHM (now the International Microelectronics and Packaging Society, IMAPS) symposia. Since that time, the course has been presented at that venue and on-site at a number of industrial and government organizations. The course has been continually revised to reflect the many evolutionary changes in materials and processes. Microwave technology has existed for almost 175 years. It was only after the invention of the klystron, just before World War II, that microwave design and manufacture moved from a few visionaries to the growth the industry sees today. Over the last decade alone there have been exploding applications for all types of high frequency electronics in the miltary, automotive, wireless, computer, telecommunications and medical industries. These have placed demands, unimaginable a decade ago, on designs, materials, processes and equipment to meet the ever expanding requirements for increasingly reliable, smaller, faster and lower cost circuits.

Keywords

Additiv Planar circuit integrated circuit material microelectromechanical system (MEMS) microwave superconductivity thin films transmission

Authors and affiliations

  • Richard Brown
    • 1
  1. 1.Richard Brown Associates, Inc.Shelton

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