Advertisement

Invasive Tightly Coupled Processor Arrays

  • VAHID LARI

Part of the Computer Architecture and Design Methodologies book series (CADM)

Table of contents

  1. Front Matter
    Pages i-xxiii
  2. Vahid Lari
    Pages 1-19
  3. Vahid Lari
    Pages 145-149

About this book

Introduction

This book introduces new massively parallel computer (MPSoC) architectures called invasive tightly coupled processor arrays.  It proposes strategies, architecture designs, and programming interfaces for invasive TCPAs that allow invading and subsequently executing loop programs with strict requirements or guarantees of non-functional execution qualities such as performance, power consumption, and reliability. For the first time, such a configurable processor array architecture consisting of locally interconnected VLIW processing elements can be claimed by programs, either in full or in part, using the principle of invasive computing. Invasive TCPAs provide unprecedented energy efficiency for the parallel execution of nested loop programs by avoiding any global memory access such as GPUs and may even support loops with complex dependencies such as loop-carried dependencies that are not amenable to parallel execution on GPUs. For this purpose, the book proposes different invasion strategies for claiming a desired number of processing elements (PEs) or region within a TCPA exclusively for an application according to performance requirements. It not only presents models for implementing invasion strategies in hardware, but also proposes two distinct design flavors for dedicated hardware components to support invasion control on TCPAs. 

Keywords

Invasive Computing Heterogeneous Multiprocessor-On-A-Chip Parallel Computing Coarse-Grained Reconfigurable Arrays (CGRAs) Dual Modular Redundancy (DMR) Triple Modular Redundancy (TMR) Soft Error Rate (SER) VLIW Processing Elements

Authors and affiliations

  • VAHID LARI
    • 1
  1. 1.Department of Computer Science 12University of Erlangen-Nuremberg Department of Computer Science 12ErlangenGermany

Bibliographic information

  • DOI https://doi.org/10.1007/978-981-10-1058-3
  • Copyright Information Springer Science+Business Media Singapore 2016
  • Publisher Name Springer, Singapore
  • eBook Packages Engineering
  • Print ISBN 978-981-10-1057-6
  • Online ISBN 978-981-10-1058-3
  • Series Print ISSN 2367-3478
  • Series Online ISSN 2367-3486
  • Buy this book on publisher's site
Industry Sectors
Pharma
Automotive
Biotechnology
Electronics
IT & Software
Telecommunications
Energy, Utilities & Environment
Aerospace
Engineering