Overview
- Presents the latest in research and development for a wide array of functional metamaterials and metadevices
- Covers topics ranging from electromagnetic, terahertz, photonic, chiral, plasmonic, nonlinear, acoustic, and mechanical metamaterials to frequency selective surfaces and processing, design, and manufacturing considerations
- Offers readers a combination of theoretical, design, and experimental perspectives for a better understanding of metamaterial behaviors and potential applications
- Provides a dynamic resource with full-color illustrations throughout for a broad audience of students, engineers, physicists, and technical managers with an interest in this robust and growing field
- Written by an author with 10 years of practical experience working on metamaterials for electromagnetic interference and acoustic applications as well as various metmaterial structures and metadevices for electronic/optical interconnect assemblies and printed
Part of the book series: Springer Series in Materials Science (SSMATERIALS, volume 262)
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Table of contents (12 chapters)
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Bibliographic Information
Book Title: Functional Metamaterials and Metadevices
Authors: Xingcun Colin Tong
Series Title: Springer Series in Materials Science
DOI: https://doi.org/10.1007/978-3-319-66044-8
Publisher: Springer Cham
eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)
Copyright Information: Springer International Publishing AG, part of Springer Nature 2018
Hardcover ISBN: 978-3-319-66043-1Published: 22 September 2017
Softcover ISBN: 978-3-319-88162-1Published: 22 August 2018
eBook ISBN: 978-3-319-66044-8Published: 14 September 2017
Series ISSN: 0933-033X
Series E-ISSN: 2196-2812
Edition Number: 1
Number of Pages: XVIII, 277
Number of Illustrations: 2 b/w illustrations, 114 illustrations in colour
Topics: Optical and Electronic Materials, Circuits and Systems, Electronic Circuits and Devices, Acoustics, Energy Harvesting
Industry Sectors: Aerospace, Chemical Manufacturing, Electronics, Energy, Utilities & Environment, IT & Software, Materials & Steel, Telecommunications