Abstract
The synthesis of intermetallic compounds in multilayer Cu–Sn films is confined within reaction islands, which can attain 100 nm in size. X-ray diffraction analysis reveals the predominance of one intermetallic Cu6Sn5 phase, while electron microscopy evidences a high crystallographic orientation of its islands. They have the same orientation to the film surface, but are rotated with respect to each other at different angles and randomly oriented to the axis, which is perpendicular to the film plane and coincide with the crystallographic axis [100] of individual single crystals.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
M. McCormack and S. Jin, J. Electron. Mater. 23 (8), 715 (1994).
W. Xiao, Y. Shi, Y. Lei, Z. Xia, and F. Guo, J. Electron. Mater. 35 (5), 1095 (2006).
J. Bertheau, F. Hodaj, N. Hotellier, and J. Charbonnier, Intermetallics 51, 37 (2014).
J.-W. Yoon, S.-W. Kim, and J.-M. Koo, J. Electron. Mater. 33 (10), 1190 (2004).
H.-T. Lee, M.-H. Chen, H.-M. Jao, and T.-L. Liao, Mater. Sci. Eng. 358, 134 (2003).
T.-C. Hsuan and K.-L. Lin, Mater. Sci. Eng. 456, 202 (2007).
G. Zeng, S. Xue, L. Zhang, L. Gao, W. Dai, and J. Luo, J. Mater. Sci.: Mater. Electron. 21, 421 (2010).
W. J. Choi, T. Y. Lee, K. N. Tu, N. Tamura, R. S. Celestre, A. A. MacDowell, Y. Y. Bong, and L. Nguyen, Acta Mater. 51, 6253 (2003).
G.-S. Xu, J.-B. Zeng, M.-B. Zhou, S.-S. Cao, X. Ma, and X.-P. Zhang, in Proc. Int. Conference on Electronic Packaging Technology and High-Density Packaging (Guilin, 2012), p. 289.
S. F. Choudhury and L. Ladani, J. Electron. Mater. 43, 996 (2014).
L. Jiang, H. Jiang, and N. Chawla, J. Electron. Mater. 41 (8), 2083 (2012).
K. N. Tu, Acta Metall. 21 (4), 347 (1973).
K. N. Tu and R. D. Thoimpson, Acta Metall. 30, 947 (1982).
J.-M. Song, B.-R. Huang, C.-Y. Liu, Y.-S. Lai, Y.-T. Chiu, and T.-W. Huang, Mater. Sci. Eng., A 534, 53 (2012).
Y. Q. Wu, J. C. Barry, T. Yamamoto, Q. F. Gu, S. D. McDonald, S. Matsumura, H. Huang, and K. Nogita, Acta Mater. 60, 6581 (2012).
M.-Y. Guo, C. K. Lin, C. Chen, and K. N. Tu, Intermetallics 29, 155 (2012).
A. N. Makrushina, V. A. Plotnikov, and B. F. Dem’yanov, Izv. Altai. Gos. Univ., No. 1, 24 (2017).
R. A. Gagliano, G. Ghosh, and M. E. Fine, J. Electron. Mater. 31 (11), 1195 (2002).
R. A. Lord and A. Umantsev, J. Appl. Phys. 98, 063525 (2005).
J. O. Suh, K. N. Tu, G. V. Lutsenko, and A. M. Gusak, Acta Mater. 56, 1075 (2008).
J. Y. Huh, K. K. Hong, Y. B. Kim, and K. T. Kim, J. Electron. Mater. 33 (10), 1161 (2004).
M. S. Park and R. Arroґyave, Acta Mater. 60, 923 (2012).
C.-B. Ke, M.-B. Zhou, and X.-P. Zhang, in Proc. 14th Int. Conference on Electronic Packaging Technology (Dalian, 2013), p. 572.
J. O. Suh, K. N. Tu, and N. Tamura, JOM 58 (6), 63 (2006).
R. Zhang, Y. Tian, B. Liu, and C. Hang, in Proc. 14th Int. Conference on Electronic Packaging Technology (Dalian, 2013), p. 1276.
P. J. T. L. Oberndorff, M. Dittes, L. Petit, C. C. Chen, J. Klerk, and E. E. de Kluizenaar, in Proc. SEMI Technology Symposium, Advanced Packaging Technology II (Singapore, 2003), p. 51.
H. Li, L. Qu, H. Zhao, N. Zhao, and H. Ma, in Proc. 14th Int. Conference on Electronic Packaging Technology (Dalian, 2013), p. 1086
V. A. Plotnikov, S. V. Makarov, and A. N. Makrushina, Fundam. Probl. Sovrem. Materialoved., No. 1, 120 (2014).
Author information
Authors and Affiliations
Corresponding author
Additional information
Original Russian Text © A.N. Makrushina, V.A. Plotnikov, B.F. Demyanov, S.V. Makarov, 2018, published in Poverkhnost’, 2018, No. 9, pp. 60–66.
Rights and permissions
About this article
Cite this article
Makrushina, A.N., Plotnikov, V.A., Demyanov, B.F. et al. Crystal Structure of the Intermetallic Thin-Film Cu–Sn Condensate. J. Surf. Investig. 12, 887–892 (2018). https://doi.org/10.1134/S1027451018050087
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1027451018050087