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Adhesive Mechanism of Al2O3/Cu Composite Film via Aerosol Deposition Process for Application of Film Resistor

  • Original Article – Nanomaterials
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Abstract

Al2O3/Cu composite films, useful for film resistors, were successfully fabricated at room temperature via aerosol deposition (AD). Microstructures of the Al2O3/Cu composite films were analyzed to understand the correlations between the surface morphologies and Al2O3/Cu ratio. A scratch test was carried out by gradually increasing the load applied to the Al2O3/Cu composite films. We also evaluated the adhesion ability by measuring the tensile strength between Al2O3/Cu composite films and Al2O3 substrate. The results confirmed that the adhesive properties of Al2O3/Cu composite films were strongly influenced by two adhesive mechanisms: mechanical interlocking and anchoring bonds between the films and Al2O3 substrate. When a powder mixture containing 50 wt% of Al2O3 and Cu was deposited on the substrate, high mechanical properties and suitable resistivity were simultaneously achieved at approximately 8.02 MPa and 85.2 mΩ cm, respectively due to effective mechanical interlocking and anchoring bonds. The results further suggest that room-temperature AD method is highly favorable to fabricate heterogeneous composite films for application to film resistors.

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References

  1. Bhattacharya, S.K., Tummala, R.R.: Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors. Microelectron. J. 32(1), 11–19 (2001)

    Article  Google Scholar 

  2. Chahal, P., Tummala, R.R., Allen, M.G., Swaminathan, M.: A novel integrated decoupling capacitor for MCM-L technology. IEEE Trans. Compon. Packag. Manuf. Technol. Part B: 21(2), 184–193 (1998)

    Article  Google Scholar 

  3. Tummala, R.R.: SOP: what is it and why? A new microsystem-integration technology paradigm-Moore’s law for system integration of miniaturized convergent systems of the next decade. IEEE Trans. Adv. Packag. 27(2), 241–249 (2004)

    Article  Google Scholar 

  4. Bhattacharya, S.K., Tummala, R.R.: Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates. J. Mater. Sci. Mater. Electron. 11(3), 253–268 (2000)

    Article  Google Scholar 

  5. Lin, R.C., Lee, T.K., Wu, D.H., Lee, Y.C.: A study of thin film resistors prepared using Ni–Cr–Si–Al–Ta high entropy alloy. Adv. Mater. Sci. Eng. 2015, 1–7 (2015)

    Google Scholar 

  6. Lai, L., Zeng, W., Fu, X., Sun, R., Du, R.: Annealing effect on the electrical properties and microstructure of embedded Ni–Cr thin film resistor. J. Alloys Compd. 538, 125–130 (2012)

    Article  Google Scholar 

  7. Vinayak, S., Vyas, H.P., Muraleedharan, K., Vankar, V.D.: Ni–Cr thin film resistor fabrication for GaAs monolithic microwave integrated circuits. Thin Solid Films 514(1–2), 52–57 (2006)

    Article  Google Scholar 

  8. Vinayak, S., Vyas, H.P., Vankar, V.D.: Microstructure and electrical characteristics of Ni–Cr thin films. Thin Solid Films 515(18), 7109–7116 (2007)

    Article  Google Scholar 

  9. Rolke, J.: Nichrome thin film technology and its application. Electrocompon. Sci. Technol. 9(1), 51–57 (1981)

    Article  Google Scholar 

  10. Jacq, C., Maeder, T., Ryser, P.: High-strain response of piezoresistive thick-film resistors on titanium alloy substrates. J. Eur. Ceram. Soc. 24(6), 1897–1900 (2004)

    Article  Google Scholar 

  11. Ma, E., Anderson, W.A.: Mechanism of stabilizing RuO2/Ta2N double layer thin film resistors. Mater. Sci. Eng., B 47(2), 161–166 (1997)

    Article  Google Scholar 

  12. Wang, C.M., Hsieh, J.H., Fu, Y.Q., Li, C., Chen, T.P., Lam, U.T.: Electrical properties of TaN–Cu nanocomposite thin films. Ceram. Int. 30(7), 1879–1883 (2004)

    Article  Google Scholar 

  13. Berg, S., Nyberg, T.: Fundamental understanding and modeling of reactive sputtering processes. Thin Solid Films 476(2), 215–230 (2005)

    Article  Google Scholar 

  14. Vygranenko, Y., Wang, K., Chaji, R., Vieira, M., Robertson, J., Nathan, A.: Stability of indium-oxide thin-film transistors by reactive ion beam assisted deposition. Thin Solid Films 517(23), 6341–6344 (2009)

    Article  Google Scholar 

  15. Yan, Z., Ma, Y., Deng, P., Yu, Z., Liu, C., Song, Z.: Ag–N doped ZnO film and its p–n junction fabricated by ion beam assisted deposition. Appl. Surf. Sci. 256(7), 2289–2292 (2010)

    Article  Google Scholar 

  16. Smidt, F.A.: Use of ion beam assisted deposition to modify the microstructure and properties of thin films. Int. Mater. Rev. 35(1), 61–128 (1990)

    Article  Google Scholar 

  17. Pyun, M.W., Kim, E.J., Yoo, D.H., Hahn, S.H.: Oblique angle deposition of TiO2 thin films prepared by electron-beam evaporation. Appl. Surf. Sci. 257(4), 1149–1153 (2010)

    Article  Google Scholar 

  18. Yao, J.K., Huang, H.L., Ma, J.Y., Jin, Y.X., Zhao, Y.A., Shao, J.D., He, H.B., Yi, K., Fan, Z.X., Zhang, F., Wu, Z.Y.: High refractive index TiO2 film deposited by electron beam evaporation. Surf. Eng. 25(3), 257–260 (2009)

    Article  Google Scholar 

  19. Wang, Y., Lin, Z., Cheng, X., Xiao, H., Zhang, F., Zou, S.: Study of HfO2 thin films prepared by electron beam evaporation. Appl. Surf. Sci. 228(1–4), 93–99 (2004)

    Article  Google Scholar 

  20. Ramasamy, K., Malik, M.A., O’Brien, P.: The chemical vapor deposition of Cu2ZnSnS4 thin films. Chem. Sci. 2(6), 1170–1172 (2011)

    Article  Google Scholar 

  21. Wei, Y.Y., Eres, G., Merkulov, V.I., Lowndes, D.H.: Effect of catalyst film thickness on carbon nanotube growth by selective area chemical vapor deposition. Appl. Phys. Lett. 78(10), 1394–1396 (2001)

    Article  Google Scholar 

  22. Alguero, M., Ricote, J., Torres, M., Amorin, H., Alberca, A., Iglesias-Freire, O., Nemes, N., Holgado, S., Cervera, M., Piqueras, J., Asenjo, A., Garcia-Hernandez, M.: Thin film multiferroic nanocomposites by ion implantation. ACS Appl. Mater. Interfaces. 6(3), 1909–1915 (2014)

    Article  Google Scholar 

  23. Shi, W., Zhang, H., Zhang, G., Li, Z.: Modifying residual stress and stress gradient in LPCVD Si3N4 film with ion implantation. Sens. Actuators A Phys. 130–131, 352–357 (2006)

    Article  Google Scholar 

  24. Akedo, J.: Aerosol deposition method for fabrication of nano crystal ceramic layer. Mater. Sci. Forum 449–452, 43–48 (2004)

    Article  Google Scholar 

  25. Lee, J.H., Kim, H.K., Lee, S.H., Choi, K., Lee, Y.H.: Effect of Zn filler for percolative BaTiO3/Zn composite films fabricated by aerosol deposition. Ceram. Int. 41(9), 12153–12157 (2015)

    Article  Google Scholar 

  26. Lee, W.H., Kim, H.J., Lee, D.W., Jeong, M.G., Lim, D.S., Nam, S.M.: Al2O3-nanodiamond composite coatings with high durability and hydrophobicity prepared by aerosol deposition. Surf. Coat. Technol. 206(22), 4679–4684 (2012)

    Article  Google Scholar 

  27. Cho, M.Y., Lee, D.W., Kim, I.S., Lee, W.H., Yoo, J.W., Ko, P.J., Koo, S.M., Choi, Y.K., Oh, J.M.: Formation of silver films for advanced electrical properties by using aerosol deposition process. Jpn. J. Appl. Phys. 57(11S), 11UF05 (2018)

    Article  Google Scholar 

  28. Lee, D.W., Shin, M.C., Kim, Y.N., Oh, J.M.: Brushite ceramic coatings for dental brace brackets fabricated via aerosol deposition. Ceram. Int. 43(1), 1044–1051 (2017)

    Article  Google Scholar 

  29. Kim, C.W., Choi, J.H., Kim, H.J., Lee, D.W., Hyun, C.Y., Nam, S.M.: Effects of interlayer roughness on deposition rate and morphology of aerosol-deposited Al2O3 thick films. Ceram. Int. 38(7), 5621–5627 (2012)

    Article  Google Scholar 

  30. Lee, D.W., Kwon, O.Y., Cho, W.J., Song, J.K., Kim, Y.N.: Characteristics and mechanism of Cu films fabricated at room temperature by aerosol deposition. Nanoscale Res. Lett. 11(1), 162 (2016)

    Article  Google Scholar 

  31. Kim, H.J., Nam, S.M.: Powder preparation in aerosol deposition for Al2O3-polyimide composite thick films. Electron. Mater. Lett. 8(1), 65–70 (2012)

    Article  Google Scholar 

  32. Kim, J.H., Kim, H.K., Lee, S.H., Lee, S.G., Kim, J.S., Kim, J.S., Lee, Y.H.: Dielectric properties of percolative BaTiO3/Ni composite film fabricated by aerosol deposition process. J. Mater. Sci. Mater. Electron. 27(8), 8567–8572 (2016)

    Article  Google Scholar 

  33. Cho, M.Y., Park, S.J., Kim, S.M., Lee, D.W., Kim, H.K., Koo, S.M., Moon, K.S., Oh, J.M.: Hydrophobicity and transparency of Al2O3-based poly-tetra-fluoro-ethylene composite thin films using aerosol deposition. Ceram. Int. 44(14), 16548–16555 (2018)

    Article  Google Scholar 

  34. Lee, D.W., Cho, M.Y., Kim, I.S., Kim, Y.N., Lee, D., Koo, S.M., Park, C., Oh, J.M.: Experimental and numerical study for Cu metal coatings at room temperature via powder spray process. Surf. Coat. Technol. 353, 66–74 (2018)

    Article  Google Scholar 

  35. Nouri, A., Hodgson, P.D., Wen, C.: Effect of ball-milling time on the structural characteristics of biomedical porous Ti–Sn–Nb alloy. Mater. Sci. Eng., C 31(5), 921–928 (2011)

    Article  Google Scholar 

  36. Hanft, D., Exner, J., Schubert, M., Stocker, T., Fuierer, P., Moos, R.: An overview of the aerosol deposition method: process fundamentals and new trends in materials applications. J. Ceram. Sci. Technol. 6(3), 147–182 (2015)

    Google Scholar 

  37. Kim, H.J., Yoon, Y.J., Kim, J.H., Nam, S.M.: Application of Al2O3-based polyimide composite thick films to integrated substrates using aerosol deposition method. Mater. Sci. Eng. B Solid State Mater. Adv. Technol. 161(1), 104–108 (2009)

    Article  Google Scholar 

  38. Fu, K., Sheppard, L., Chang, L., An, X., Yang, C., Ye, L.: Comparative study on plasticity and fracture behavior of Ti/Al multilayers. Tribol. Int. 126, 344–351 (2018)

    Article  Google Scholar 

  39. Azhar, A.Z.A., Mohamad, H., Ratnam, M.M., Ahmad, Z.A.: The effects of MgO addition on microstructure, mechanical properties and wear performance of zirconia-toughened alumina cutting inserts. J. Alloys Compd. 497(1–2), 316–320 (2010)

    Article  Google Scholar 

  40. Chaudhri, M.M.: Subsurface strain distribution around Vickers hardness indentations in annealed polycrystalline copper. Acta Mater. 46(9), 3047–3056 (1998)

    Article  Google Scholar 

  41. Hench, L.L., Splinter, R.J., Allen, W.C., Greenlee, T.K.: Bonding mechanisms at the interface of ceramic prosthetic materials. J. Biomed. Mater. Res. 5(6), 117–141 (1971)

    Article  Google Scholar 

  42. Krupicka, A., Johansson, M., Hult, A.: Use and interpretation of scratch tests on ductile polymer coatings. Prog. Org. Coat. 46(1), 32–48 (2003)

    Article  Google Scholar 

  43. Miranda-hernandez, J.G., Moreno-guerrero, S., Soto-guzman, A.B., Rocha-rangel, E.: Production and characterization of Al2O3-Cu composite materials. J. Ceram. Proc. Res. 7, 311–315 (2006)

    Google Scholar 

  44. Cho, M.Y., Lee, D.W., Kim, W.J., Kim, Y.N., Koo, S.M., Lee, D., Moon, K.S., Oh, J.M.: Fabrication of TiO2/Cu hybrid composite films with near zero TCR and high adhesive strength via aerosol deposition. Ceram. Int. 44(15), 18736–18742 (2018)

    Article  Google Scholar 

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Acknowledgements

This present Research has been conducted by the Research Grant of Kwangwoon University in 2018. And, this work was supported by the National Research Foundation of Korea (NRF) funded by Korean government (MSIP; Ministry of Science, ICT and Future Planning) (No. 2018R1D1A1B07045295) and the High Level Track of Power Semiconductor Technology for Renewable Energy and Electrical Vehicle (No. 20174010201290) of the Korea Institute of Energy Technology Evaluation and Planning (KETEP).

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Authors and Affiliations

  1. Department of Electronic Materials Engineering, Kwangwoon University, 20 Kwangwoon-ro, Nowon-gu, Seoul, 01897, Republic of Korea

    Myung-Yeon Cho, Sang-Mo Koo, Jaesik Kim & Jong-Min Oh

  2. Material Technology Center, Korea Testing Laboratory, 87 Digitalro 26-gil, Guro-gu, Seoul, 152-718, Republic of Korea

    Dong-Won Lee

  3. Department of Electrical Engineering, Chosun University, 309 Pilmun-daero, Dong-gu, Gwangju, 61452, Republic of Korea

    Pil-Ju Ko

  4. Samsung Electro-Mechanics, Research Group, 150, Maeyeong-ro, Yeongtong-gu, Suwon-si, Gyeonggi-Do, Republic of Korea

    Youn-Kyu Choi

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  1. Myung-Yeon Cho
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Correspondence to Youn-Kyu Choi or Jong-Min Oh.

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Cho, MY., Lee, DW., Ko, PJ. et al. Adhesive Mechanism of Al2O3/Cu Composite Film via Aerosol Deposition Process for Application of Film Resistor. Electron. Mater. Lett. 15, 227–237 (2019). https://doi.org/10.1007/s13391-018-00111-w

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  • DOI: https://doi.org/10.1007/s13391-018-00111-w

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