Electronic Materials Letters is a comprehensive publication covering all aspects of research and technology in electronic materials.
Since its inception in 1946, Korean Institute of Metals and Materials (KIM) has undertaken exchanges with institutes of metals and materials in other countries.
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Please refer to the Submission Checklist before submitting your manuscript, to ensure all necessary criteria have been met.
If you submit your TOC as .jpg, .png and other image format, the size must be 230.4 high and 412.8 wide in pixels.
Find out more about full Instructions for Authors
Authors are required to pay a publication fee (KRW 40,000 per page) for the printed version of the article. However, it will be temporarily exempted for articles submitted from countries other than Korea.