Abstract
The effect of working pressure on the properties of Al2O3 films was investigated in direct-type plasma-enhanced atomic layer deposition. Increasing pressure yielded a denser Al2O3 film and a thinner SiOx interlayer, but only slightly affected the Al2O3 film thickness. The diffusivity of O atoms was evaluated by using time-averaged emission intensities of the He I and O I lines. The consumption rate of O radicals and the production rate of H radicals, as functions of plasma exposure time, were deduced from analyzing temporal evolutions of emission intensities of the O I and Hα lines, respectively. The amounts of C and H impurities in the film were confirmed by using an X-ray photoelectron spectroscopy. Finally, the mechanisms by which the working pressure affected the properties of Al2O3 films were discussed based on the experimental results.
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This work is supported by the Development Program of Manufacturing Technology for Flexible Electronics with High Performance funded by Korea Institute of Machinery and Materials (KIMM).
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Hur, M., Kim, D.J., Kang, W.S. et al. Influence of Working Pressure on the Al2O3 Film Properties in Plasma-Enhanced Atomic Layer Deposition. Plasma Chem Plasma Process 36, 679–691 (2016). https://doi.org/10.1007/s11090-015-9677-y
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DOI: https://doi.org/10.1007/s11090-015-9677-y