Reduced thickness interconnect model using GNR to avoid crosstalk effects
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In this research article, we propose a reduced thickness multilayer graphene nanoribbon (MLGNR) interconnect model to reduce crosstalk effects. The \(10\times \) higher current capability of MLGNR than copper (Cu) makes it an attractive choice to alleviate electromigration problem. The lower resistance of MLGNR is also an important factor to reduce interconnect delay. We have shown that a reduced thickness interconnect structure using MLGNR can reduce the crosstalk effects significantly without compromising the other benefits. The analysis is performed for side-contact GNR (SC-GNR) and top-contact GNR (TC-GNR) structure. Our analysis shows that the reduced thickness side-contact GNR interconnects can achieve \(\sim \)1.02 to \(2.36\times \) reduction in crosstalk induced delay as compared with Cu. Our analysis also shows that the top-contact GNR structure with few layers can also achieve \(\sim \)1.58 to \(1.95\times \) reduction in crosstalk induced delay as compared with Cu. We have performed crosstalk noise and overshoot/undershoot analysis using our proposed model. It is shown that the near-end and far-end crosstalk noise and overshoot/undershoot for SC-GNR and TC-GNR structures are significantly smaller than that of Cu.
KeywordsCrosstalk Delay Multilayer graphene nanoribbon (MLGNR) Noise Overshoot/undershoot
Compliance with Ethical Standards
This work is partially supported by the DIT, Government of West Bengal, India under VLSI Design Project.
Conflict of Interest
The authors declare that they have no conflict of interest.
Human Participants and/or Animals
This article does not contain any studies with human participants or animals performed by any of the authors.
Informed consent was obtained from all individual participants included in the study.
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