Abstract
Recently, multilayered structures have been utilized in MEMS applications, including infrared focal plane arrays, radio-frequency (RF) components, micromachined mirrors, etc. It is well known that MEMS devices are highly dependent on material parameters such as Young’s modulus and residual stress of the multilayered films. These properties determine both the final shape and the functionality of released microstructures and should therefore be accurately evaluated. Young’s modulus and residual stress for single-layer films have been widely studied by the cantilever deflections, wafer curvatures, displacements of variously designed microstructures, buckling lengths, membrane deflections, resonance frequency, pull-in voltages, and double-clamped beam deflections. However, these methods are not easily extended to multilayered films. Thus it is significantly expected to directly measure both Young’s modulus and residual stress for multilayer films simultaneously. This chapter presents some methods to characterize the material properties of the composite films by electrostatic pull-in testing and the resonance frequency testing approaches adopting the composite double-clamped beam or the cantilever beam. The analytical models are presented and test structures with different lengths and widths are designed. In situ methods for simultaneously extracting material properties (Young’s modulus and residual stress) of each layer for the composite films are reported. The extracting methods have been confirmed by FEM simulations and experiments.
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Zhou, ZF., Huang, QA., Guo, XG., Gu, YF. (2017). On-line Test Microstructures of the Mechanical Properties for Micromachined Multilayered Films. In: Huang, QA. (eds) Micro Electro Mechanical Systems. Micro/Nano Technologies, vol 2. Springer, Singapore. https://doi.org/10.1007/978-981-10-2798-7_9-1
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DOI: https://doi.org/10.1007/978-981-10-2798-7_9-1
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