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Fig. 13 |

Fig. 13

From: Thermal Stress in MEMS

Fig. 13

The multimorphs operate similarly to previous devices, with a static capacitance pad and a temperature-sensitive multimorph. The capacitance is changed between the metal on the beam and the low-resistivity silicon substrate (© 2012 IEEE. Reprinted, with permission, from A 600 °C wireless multimorph-based capacitive MEMS For component health monitoring by S. Scott, M. Scuderi and D. Peroulis, in Tech. Digest 25th IEEE International Conference on MicroElectroMechanical Systems, Jan/Feb 2012)

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