Overview
Integrated Circuit (IC) packages are usually composite components made of multiple materials, with different mechanical and thermal properties, which are bonded together. High stresses often occur at corners between different components within the packages where discontinuities of geometry or material properties are present. Delaminations usually initiate from these corners when packages undergo adverse thermal or moisture environments [1–4]. Hence, in order to prevent delaminations from occurring and to improve package reliability, it is crucial to accurately and efficiently evaluate the stresses at corners within the package. However, with conventional numerical methods such as the finite element method, it is always a challenge to evaluate the stresses at the corners since stress singularity occurs at these corners.
In this entry, a method is developed to precisely characterize the stresses at the corners within the packages. The intrinsic properties arising from the...
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Wei, Z., Meng, L.K., Tay, A. (2014). Thermal Stresses at Multi-Material Corners and Cracks in Plastic IC Packages. In: Hetnarski, R.B. (eds) Encyclopedia of Thermal Stresses. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-2739-7_271
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DOI: https://doi.org/10.1007/978-94-007-2739-7_271
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-007-2738-0
Online ISBN: 978-94-007-2739-7
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