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Encyclopedia of Continuum Mechanics pp 1–10Cite as

Application of Analytical Modeling in the Design for Reliability of Electronic Packages and Systems

Definitions

Electronic packaging is a discipline within the field of materials, electrical and mechanical engineering concerned with enclosures and protective features built into the electronic devices. It comprises a wide variety of technologies. It applies both to end products and to components.

Electronic systems design deals with the multidisciplinary design issues of complex electronic devices and systems, such as mobile phones and computers. The subject covers a broad spectrum, from the design and development of an electronic system (new product development) to assuring its proper function, service life, and disposal.

Analytical Classical Mechanics and Applied Physics-Based Modeling, Its Role, and Significance

Mechanical (“physical”) performance of electronic and photonic materials, assemblies, packages, and systems is the bottleneck of the today’s electronic and photonic reliability engineering. Nothing happens to an electron or a photon. But, as we used to say at Bell Labs, “if...

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Author information

Authors and Affiliations

  1. Portland State University, Portland, OR, USA

    Ephraim Suhir

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  1. Ephraim Suhir
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Correspondence to Ephraim Suhir .

Editor information

Editors and Affiliations

  1. Institut für Mechanik, Otto-von-Guericke-Universität Institut für Mechanik, Magdeburg, Germany

    Holm Altenbach

  2. Griffith University (Gold Coast Campus), Griffith School of Engineering Griffith University (Gold Coast Campus), Southport, QLD, Australia

    Prof. Dr. Andreas Öchsner

Section Editor information

  1. Departments of Mech. and Mat., and Elect. and Comp. Engineering, Portland State University, Portland, OR, USA

    Ephraim Suhir

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Suhir, E. (2019). Application of Analytical Modeling in the Design for Reliability of Electronic Packages and Systems. In: Altenbach, H., Öchsner, A. (eds) Encyclopedia of Continuum Mechanics. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-53605-6_370-1

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