Synonyms
Definition
Wire bonding is a micro pressure welding method joining same or different types of material by means of pressure, temperature, and/or ultrasonic power in a solid state.
Extended Definition
The wire bonding technique provides a universal, though in principle, always sequential process for device- and top-level-chip-interconnects. With over nine billion wire bonds per year, it is one of the most common interconnect technologies (Harman 2010). Wire bonding may be classified using various process parameters. The ones primarily used are shown in Table 1.
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References
Harman G (2010) Wire bonding in microelectronics, 3rd edn. McGraw-Hill, New York
Lang KD, Rudolf F (1997) Drahtbonden elektronischer Baugruppen [Wire bonding of electronic assemblies]. In: Scheel W, Hanke HJ (eds) Baugruppentechnologie der Elektronik [Electronics assembly technology]: montage [assembly], vol 3, Leuze, Berlin, pp 415–469 (in German)
Meyer A, Grauer M, Rittner M (2009) Methodisches Vorgehen zur integralen Auslegung von Produkt und Montage [Methodology for the integral design of product and assembly]. In: Feldmann K (ed) Montage in der Leistungselektronik für globale Märkte: Design, Konzepte, Strategien [Assembly of power electronics modules for global markets: design, concepts, strategies]. Springer, Berlin, pp 5–81 (in German)
Osterwald F (1999) Verbindungsbildung beim Ultraschall-Drahtbonden: Einfluß der Schwingungsparameter und Modellvorstellungen [Joint formation during ultrasonic wire bonding: influence of vibration parameters and model assumptions]. Dissertation, Technical University Berlin (in German)
Further Reading
Chauhan PS, Choubey A, Zhong Z, Pecht MG (2014) Copper wire bonding. Springer, New York
Kästle C, Franke J (2014) Comparative analysis of the process window of aluminum and copper wire bonding for power electronics applications. In: Proceeding of the 2014 international conference on electronics packaging (ICEP), Tokyo, pp 335–340
Lutz J, Schlangenotto H, Scheuermann U, De Doncker R (2011) Semiconductor power devices: physics, characteristics, reliability. Springer, Berlin
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Kästle, C., Franke, J. (2018). Wire Bonding. In: CIRP Encyclopedia of Production Engineering. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-35950-7_16839-1
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DOI: https://doi.org/10.1007/978-3-642-35950-7_16839-1
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Publisher Name: Springer, Berlin, Heidelberg
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Online ISBN: 978-3-642-35950-7
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