Fig. 5

Some rough surfaces resulting from pretreatment prior to adhesive bonding: (a) porous anodic oxide on aluminum (schematic); (b) dendrites of zinc electrodeposited onto a zinc surface; (c) black CuO layer produced on copper; (d) PTFE irradiated by argon ions (After Koh et al. 1997); (e) adhesion of copper to silica using a mechanical key (van der Putten 1993). (i) TiW islands deposited; (ii) Pd activator adsorbed and HF etching; (iii) electroless Cu deposited; (iv) Cu electrodeposited