Abstract
The thermal properties of adhesives affect the rate of cure, whether the latter is by evaporation, cooling, or chemical reaction. In the latter case, cure may not go to completion in the sense that not all monomer is reacted, or may not be possible at all above a ceiling temperature. The heat of polymerization is a useful guide to what may happen.
The glass transition temperature of a cured adhesive is of critical importance in that although there are both sub-Tg and super-Tg adhesives, crossing Tg in service is not acceptable. Tg also has a role in latex adhesives forming cohesive films. Water plasticizes epoxide adhesives and so lower Tg. Some adhesives are partially crystalline with a melting point Tm.
Adhesives exhibit a mixture of viscous and elastic properties and obey the WLF equation. This indicates that the fraction of free volume at the glass transition is 2.5%.
Consideration is given to thermal conductivity and thermal expansion, and the breakdown of adhesives at elevated temperatures. Shelf-life and pot-life vary with temperature.
The main methods of obtaining thermal information on adhesives are reviewed; these are differential scanning calorimetry (DSC), dynamic mechanical thermal analysis (DMTA), and thermogravimetric analysis (TGA).
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Comyn, J. (2018). Thermal Properties of Adhesives. In: da Silva, L., Öchsner, A., Adams, R. (eds) Handbook of Adhesion Technology. Springer, Cham. https://doi.org/10.1007/978-3-319-55411-2_18
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DOI: https://doi.org/10.1007/978-3-319-55411-2_18
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