Abstract
Electrically conductive adhesives (ECAs) are used for the joining of electrical and electronic components in the electrical industry. ECAs are composites consisting of a polymeric matrix and electrically conductive fillers. The mechanical properties are provided by the polymeric matrix, while the electrical conductivity is supplied by the conductive fillers. Typically, there are three types of conductive adhesives, viz., isotropic, anisotropic, and non-conductive adhesives. These adhesives are classified according to their conductivity, which is controlled by the conductive filler content in the polymer matrix. For their application in the electrical industry, there are two main specific requirements for these adhesives, i.e., electrical conductivity and thermomechanical properties. In this chapter, the mechanism underlying the electrical conduction in adhesive joints is derived, while the thermal and mechanical parameters that should be measured are introduced. Some recent advances related to the improvement of ECAs are also addressed. In terms of the evaluation of the reliability of adhesives in electronics, the basic test procedures, including several specific test methods and analysis techniques, are explained. Recommendations are also given to select a suitable test method.
References
Amoli BM, Trinidad J, Hu A, Zhou YN et al (2015) Highly electrically conductive adhesives using silver nanoparticle(Ag NP)-decorated graphene: the effect of NPs sintering on the electrical conductivity improvement. J Mater Sci: Mater Electron 26:590–600
Aschenbrenner R et al (1997) Adhesive flip chip bonding on flexible substrates. In: Proceedings of 1st IEEE international symposium on polymeric electronics packaging, IEEE, p 86
Chen C, Wang L, Li R et al (2007) Effect of silver nanowires on electrical conductance of system composed of silver particles. J Mater Sci 42:3172–3176
Chen D, Qiao X, Qiu X et al (2010) Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes. J Mater Sci: Mater Electron 21:486–490
Chueh TC, Hu CH, Yen SC (2015) Electrically conductive adhesives with low Ag content prepared by Ag self-activated plating and PEDOT:PSS. J Electrochem Soc 162:D56–D61
Desvergne S, Gasse A, Pron A (2011) Electrical characterization of polyaniline-based adhesive blends. J Appl Polym Sci 120:1965–1973
Grujicic M, Cao G, Roy WN (2004) A computational analysis of the percolation threshold and the electrical conductivity of carbon nanotubes filled polymeric materials. J Mater Sci 39:4441–4449
Gumfekar SP et al (2011) Silver-polyaniline-epoxy electrical conductivity adhesives – a percolation threshold analysis. In: IEEE 13th electronics packaging technology conference, IEEE, p 180
Habenicht G (1990) Kleben. Springer-Verlag, Berlin
Holm R (1979) Electric contacts. Springer-Verlag, Berlin
Kim HK, Shi FG (2001) Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density. Microelectron J 32:315–321
Kim JW, Kim DG, Hong WS et al (2005) Evaluation of solder joint reliability in flip-chip packages during accelerated testing. J Electron Mater 34:1550–1557
Kim JW, Kim DG, Lee YC et al (2008a) Analysis of failure mechanism in anisotropic conductive and non-conductive film interconnections. IEEE Trans Compon Packag Tech 31:65–73
Kim JW, Lee YC, Jung SB (2008b) Reliability of conductive adhesives as a Pb-free alternative in flip-chip application. J Electron Mater 37:9–16
Kim J, Yim BS, Kim JM, Kim J (2012) The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs). Microelectron Reliab 52:595–602
Kim KS, Bang JO, Choa YH et al (2013) The characteristics of Cu nanopaste sintered by atmospheric-pressure plasma. Microelectron Eng 107:121–124
Kim KS, Park BG, Jung KH et al (2015) Microwave sintering of silver nanoink for radio frequency applications. J Nanosci Nanotechnol 15:2333–2337
Kwon WS, Paik KW (2004) Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis. Int J Adhes Adhes 24:135–142
Lau JH (1995) Flip chip technologies. McGraw-Hill, New York
Lau JH, Wong CP, Lee NC, Lee SWR (2003) Electronics manufacturing with lead-free, halogen-free & conductive-adhesive materials. McGraw-Hill, New York
Lee HH, Chou KS, Shih ZW (2005) Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives. Int J Adh Adh 25:437–441
Li Y, Wong CP (2006) Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Mater Sci Eng R 51:1–35
Lilei Y, Zonghe L, Johan L et al (1999) Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives. In: IEEE transactions on electronics packaging manufacturing, IEEE, p 299
Liu YH, Lin KL (2005) Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration. J Mater Res 20:2184–2193
Maattanen J (2003) Contact resistance of metal-coated polymer particles used in anisotropically conductive adhesives. Solder Surf Mount Tech 15:12–15
Markley DL, Tong QK, Magliocca DJ et al (1999) Characterization of silver flakes utilized for isotropic conductive adhesives. In: Proceedings of international symposium on advanced packaging materials, IEEE, p 16
Mayo MJ (1996) Processing of nanocrystalline ceramics from ultrafine particles. Int Mater Rev 41:85–115
Mir IM, Kumar D (2010) Development of polypyrrole/epoxy composites as isotropically conductive adhesives. J Adhes 86:447–462
Noh BI, Lee BY, Jung SB (2008) Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill. Mater Sci Eng A 483–484:464–468
Noh BI, Yoon JW, Kim JW et al (2009) Reliability of Au bump flip chip packages with adhesive materials using four-point bending test. Int J Adhes Adhes 29:650–655
Plumbridge WJ (2004) Long term mechanical reliability with lead-free solders. Solder Surf Mt Tech 16:13–20
Ruschau GR, Yoshikawa S, Newnham RE (1992) Resistivities of conductive composites. J Appl Phys 72:953–959
Song CH, Ok KH, Lee CJ et al (2015) Intense-pulsed-light irradiation of Ag nanowire–based transparent electrodes for use in flexible organic light emitting diodes. Org Electron 17:208–215
Wu H, Wu X, Ge M et al (2007) Properties investigation on isotropical conductive adhesives filled with silver coated carbon nanotubes. Comps Sci Technol 67:1182–1186
Yang X, He W, Wang S et al (2012) Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods silver nanoparticles and modified epoxy resin. J Mater Sci: Mater Electron 23:108–114
Yim MJ, Paik KW (1998) Design and understanding of anisotropic conductive films (ACF’s) for LCD packaging. IEEE T Comp Pack Manu Tech 21:226–224
Yim BS, Kim K, Kim J et al (2016) Influence of functionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives. J Mater Sci: Mater Electron 27:4516–4525
Yin CY, Lu H, Bailey C et al (2006) Analyzing the performance of flexible substrates for lead-free applications. In: Proceedings of 7th international conference on thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems, IEEE, p 1
Yu H, Adams RD, da Silva LFM (2013) Development of a dilatometer and measurement of the shrinkage behaviour of adhesives during the cure process. Int J Adhes Adhes 47:26–34
Zallen R (1983) The physics of amorphous solids. Wiley, New York
Zhang YL, Shi DXQ, Zhou W (2006) Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading. Microelectron Reliab 46:409–420
Zhang ZX, Chen XY, Xiao F (2011) The sintering behavior of electrically conductive adhesives filled with surface modified silver nanowires. J Adhes Sci Technol 25:1465–1480
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2017 Springer International Publishing AG
About this entry
Cite this entry
Kim, KS., Kim, JW., Jung, SB. (2017). Electrical Industry. In: da Silva, L., Öchsner, A., Adams, R. (eds) Handbook of Adhesion Technology. Springer, Cham. https://doi.org/10.1007/978-3-319-42087-5_50-2
Download citation
DOI: https://doi.org/10.1007/978-3-319-42087-5_50-2
Received:
Accepted:
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-42087-5
Online ISBN: 978-3-319-42087-5
eBook Packages: Springer Reference EngineeringReference Module Computer Science and Engineering