Processing Quality Control

  • Kosuke Haraga
Living reference work entry


The processing quality control of adhesively bonded joints in actual production lines is discussed in this chapter. To improve the yield ratio of products, a scientific approach based on both probabilistic design and statistical treatment is indispensable. In addition, control of environmental conditions and materials is also very important. For the purpose, a realistic trial-and-error approach should be done to meet any demands or to solve problems occurring in the production. Investigation of reasons decreasing joint strength is another key point that should be done. The strength decrease occurs often due to mechanical or chemical mismatch of adherends and adhesives. The surface treatment of adherends is important too. Inspection, which can be carried out easily, is desirable in actual production lines.

Process design should be done appropriately to improve the efficiency and the economy of the lines and to increase the yield ratio of products. Parallel processes should be avoided if sequential processes can be adopted. Reduction of operator’s tasks is another important issue. The concept of foolproof should be introduced in the process design.`

Proper adhesive selection is vitally important, not only for good strength but also for increasing operation efficiency. New types of adhesives have been available to meet the demands to control the process easily. The education and training of operators are also an essential issue. Operators should learn standard procedures to perform their work appropriately. The necessary information should be exchanged properly.


  1. Arenas JM, Narbon JJ et al (2010) Int J Adhes Adhes 160:165Google Scholar
  2. Bandaruk W (1962) J Appl Polym Sci 217:220Google Scholar
  3. DeFrayne GO (1983) Adhesive specification and quality control. In: Schneberger GL (ed) Adhesives in manufacturing. Marcel Dekker, New YorkGoogle Scholar
  4. Denki Kagaku Kogyo Co., Ltd. (2009) HARDLOC brochureGoogle Scholar
  5. Espie AW (1995) Int J Adhes Adhes 81:85Google Scholar
  6. Gorbatkina Yu A, Ivanova-Mumjieva VG (2001) Int J Adhes Adhes 41:48Google Scholar
  7. Hadj-Ahmed R, Foret G, Ehrlacher A (2001) Mech Mater 77:84Google Scholar
  8. Haraga K (1992) Adhes Technol 28:33Google Scholar
  9. Haraga K (2008) Kagaku Kogyo 271:277Google Scholar
  10. Haraga K, Ganryu Y et al (2009) Mitsubishi Denki Giho 19:23Google Scholar
  11. Montgomery DC (2008) Introduction to statistical quality control, 6th edn. Wiley, HobokenzbMATHGoogle Scholar
  12. Nakajima Y, Taguchi K et al (1997) Eng Mats 87:104Google Scholar
  13. Petrie EM (2007) Handbook of adhesives and sealants. McGraw-Hill, New York, pp 203–226Google Scholar
  14. Roberts RW (1990) Processing quality control. In: Adhesives and sealants, vol 3. Engineered material handbook. ASM International, pp 735–742Google Scholar
  15. Seo DW, Lim JK (2005) Compos Sci Technol 1421:1427Google Scholar
  16. Straalen IJJ, Wardenier J et al (1998) Int J Adhes Adhes 41:49Google Scholar
  17. Stroud WJ, Krishnamurthy T et al (2001) AIAA2001– 1238 1:12Google Scholar
  18. Teramoto K, Okajima T et al (1993) J Adhes Soc Jpn 37:44Google Scholar
  19. Tomioka T (2010) Nikkei Monozukuri 59:67Google Scholar
  20. Vallee T, Correia JR et al (2005a) Compos Sci Technol 331:340Google Scholar
  21. Vallee T, Riberio J et al (2005b) Proc Int Symp Bond Behav FRP Struc 149:155Google Scholar
  22. Vallee T, Correia JR et al (2006) Compos Sci Technol 1915:1930Google Scholar

Copyright information

© Springer International Publishing AG 2017

Authors and Affiliations

  1. 1.Tapes and Adhesives Department, Electronic Materials Division, Electronic Materials Business UnitDenki Kagaku Kogyo Kabushiki KaishaChuo-ku, TokyoJapan

Personalised recommendations