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Handbook of Adhesion Technology pp 1–25Cite as

Physical Properties

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Abstract

A number of physical properties are relevant and important for characterizing adhesives, providing insights into the underlying behavior of the base polymer(s) as well as the effects that fillers, additives, and other factors may play on the behavior of the uncured adhesive, and also the quality and performance of bonded joints that may result. Characterizing these adhesive properties, interpreting the results, and understanding the implications provide important insights for assuring quality control, for improving bond performance, for assessing the relative merits of adhesive options for a given application, and for understanding the polymer more completely. This chapter addresses several relevant physical properties of bulk adhesives, including viscosity, density, and stress-strain behavior. Methods of characterizing these properties are discussed, along with insights for interpreting these quantities and their implications for polymeric adhesive systems.

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Author information

Authors and Affiliations

  1. Biomedical Engineering and Mechanics Department, Virginia Polytechnic Institute and State University, Blacksburg, VA, 24061-0219, USA

    David A. Dillard

Authors
  1. David A. Dillard
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Correspondence to David A. Dillard .

Editor information

Editors and Affiliations

  1. Department of Mechanical Engineering, Faculty of Engineering of the University of Porto, Porto, Portugal

    Lucas F. M. da Silva

  2. Griffith School of Engineering, Griffith University (Gold Coast Campus), Southport Queensland, Australia

    Andreas Öchsner

  3. Department of Engineering Science, University of Oxford, Oxford, United Kingdom

    Robert D. Adams

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© 2017 Springer International Publishing AG

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Dillard, D.A. (2017). Physical Properties. In: da Silva, L., Öchsner, A., Adams, R. (eds) Handbook of Adhesion Technology. Springer, Cham. https://doi.org/10.1007/978-3-319-42087-5_17-2

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  • DOI: https://doi.org/10.1007/978-3-319-42087-5_17-2

  • Received:

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-42087-5

  • Online ISBN: 978-3-319-42087-5

  • eBook Packages: Springer Reference EngineeringReference Module Computer Science and Engineering

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