Synonyms
Electrostatic bonding; Field-assisted bonding
Definition
Anodic bonding is a technique to produce hermetic seals between metals and glass insulators. Anodic bonding is mostly used for hermetic sealing of silicon and glass. Different from other sealing techniques, anodic bonding involves heating and applying an electrical field to a bonding pair.
Overview
The anodic bonding technique was first reported in 1969, with the name of field-assisted glass-metal sealing [1]. It has since been developed into a widely used hermetic sealing technique for a variety of MEMS devices and microfluidic devices. The equipment for anodic bonding can be simply a hot plate on which the bonding parts are heated to the sealing temperature between 300 °C and 600 °C and a DC power supply to apply a high voltage from 200 up to 2,000 V to the bonding parts. The bonding process takes only a few minutes. Figure 1shows schematically the setup for anodic bonding, where the conductive part, in this case a...
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References
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Cui, Z. (2015). Anodic Bonding. In: Li, D. (eds) Encyclopedia of Microfluidics and Nanofluidics. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5491-5_41
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DOI: https://doi.org/10.1007/978-1-4614-5491-5_41
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