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Solid State Microjoining Processes in Manufacturing

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Handbook of Manufacturing Engineering and Technology

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Abstract

This chapter presents the solid-state bonding technologies, in particular the thermocompression bonding and thermosonic bonding technologies, which are used to form microjoints in the electronics industry. The diffusion bonding mechanism and the key bonding conditions required to form reliable joints are presented. Moreover, the recent progresses in the thermocompression bonding and thermosonic ball-wedge bonding technologies are highlighted. Lastly, the effects of different bonding materials and their surface characteristics on the joints’ performance are also discussed.

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Acknowledgement

For section “Advances in the Manufacturing of Thermosonic Ball-Wedge Bonding,” the authors sincerely thank their fellow colleagues from R&D-APL, R&D-MCL, MTD, QA, and engineering divisions of Heraeus Materials Singapore Pte. Ltd. for the data collection.

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Authors and Affiliations

  1. Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology and Research (A*STAR), 71 Nanyang Drive, 638075, Singapore, Singapore

    Sharon Mui Ling Nai

  2. Heraeus Materials, Singapore, Singapore

    Murali Sarangapani & Johnny Yeung

Authors
  1. Sharon Mui Ling Nai
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  2. Murali Sarangapani
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  3. Johnny Yeung
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Corresponding author

Correspondence to Sharon Mui Ling Nai .

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Editors and Affiliations

  1. Faculty of Engineering, Mechanical Engineering Department, National University of Singapore, Singapore, Singapore

    Andrew Y. C. Nee

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Nai, S.M.L., Sarangapani, M., Yeung, J. (2015). Solid State Microjoining Processes in Manufacturing. In: Nee, A. (eds) Handbook of Manufacturing Engineering and Technology. Springer, London. https://doi.org/10.1007/978-1-4471-4670-4_60

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