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Solder Joint Technology

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Handbook of Manufacturing Engineering and Technology

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Abstract

This chapter introduces the key functions of solder joints and the various soldering processes. The evolution from leaded to lead-free solder materials is reported. Furthermore, the recent developments of high-temperature solders and composite solders due to the ever demanding functional and service requirements are discussed. The properties of different solder materials and their solder joints are also presented. Finally, reliability studies of the solder materials and their solder joints are discussed in terms of mechanical behavior, temperature cycling, and drop impact.

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Authors and Affiliations

  1. Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology and Research (A*STAR), 71 Nanyang Drive, 638075, Singapore, Singapore

    Sharon Mui Ling Nai

  2. National University of Singapore, 10 Kent Ridge Crescent, 119260, Singapore, Singapore

    Long Bin Tan

  3. Advanced Micro Devices, Singapore, Singapore

    Cheryl Selvanayagam

Authors
  1. Sharon Mui Ling Nai
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  2. Long Bin Tan
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  3. Cheryl Selvanayagam
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Corresponding author

Correspondence to Sharon Mui Ling Nai .

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Editors and Affiliations

  1. Faculty of Engineering, Mechanical Engineering Department, National University of Singapore, Singapore, Singapore

    Andrew Y. C. Nee

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Nai, S.M.L., Tan, L.B., Selvanayagam, C. (2015). Solder Joint Technology. In: Nee, A. (eds) Handbook of Manufacturing Engineering and Technology. Springer, London. https://doi.org/10.1007/978-1-4471-4670-4_59

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