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Electronic Packaging Applications

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Book cover Springer Handbook of Experimental Solid Mechanics

Part of the book series: Springer Handbooks ((SHB))

Abstract

Electronic packaging is a field in rapid evolution due to strong and competing customer demands for increased functionality and performance, further miniaturization, heightened reliability, and lower costs. Such product drivers cause a myriad of reliability challenges for the engineer involved in the mechanical design of electronic systems, and several methods of experimental mechanics have become critical tools for the design and development of electronic products. In this chapter, we present an overview of important experimental mechanics applications to electronic packaging. Mechanics and reliability issues for modern electronic systems are reviewed, and the challenges facing the experimentalist in the packaging field are discussed. Finally, we review the state of the art in measurement technology, with the presentation of selected key applications of experimental solid mechanics to the electronic packaging field. These important applications are grouped by the goal of the measurement being made, including delamination detection, silicon stress characterization, evaluation of solder joint deformations and strains, warpage measurements, evaluation of behavior under transient loading, and material characterization. For each application, the important experimental techniques are discussed and sample results are provided.

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Abbreviations

ALT:

accelerated lift testing

BGA:

ball grid array

CBGA:

ceramic ball grid array

CCD:

charge-coupled device

CGS:

coherent gradient sensing

CMP:

chemical–mechanical polishing

CTE:

coefficient of thermal expansion

DIC:

digital image correlation

DNP:

distance from the neutral point

EMI:

electromagnetic interference

HDI:

high-density interconnect

IC:

integrated circuits

MEMS:

micro-electromechanical system

MLF:

metal leadframe package

MOEMS:

microoptoelectromechanical systems

NDE:

nondestructive evaluation

NMR:

nuclear magnetic resonance

PCB:

printed circuit board

PE:

pulse-echo

QFP:

quad flat pack

SAM:

scanning acoustic microscopy

SAM:

self-assembled monolayer

SEM:

Society for Experimental Mechanics

SEM:

scanning electron microscopy

SPM:

scanning probe microscope

SQUID:

superconducting quantum interface device

TIM:

thermal interface materials

TS:

through scan

micro-CAT:

micro computerized axial tomography

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Authors and Affiliations

  1. Department of Mechanical Engineering, Auburn University, 201 Ross Hall, 36849-5341, Auburn, AL, USA

    Jeffrey C. Suhling Prof.

  2. Department of Mechanical Engineering Center for Advanced Vehicle Electronics, Auburn University, 201 Ross Hall, 36849-5341, Auburn, AL, USA

    Pradeep Lall Prof.

Authors
  1. Jeffrey C. Suhling Prof.
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  2. Pradeep Lall Prof.
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Correspondence to Jeffrey C. Suhling Prof. or Pradeep Lall Prof. .

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Editors and Affiliations

  1. Department of Mechanical Engineering, Room 126, Latrobe Hall, The Johns Hopkins University, 21218-2681, Baltimore, MD, USA, 3400 North Charles Street

    William N. Sharpe Jr. Prof.

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Suhling, J.C., Lall, P. (2008). Electronic Packaging Applications. In: Sharpe, W. (eds) Springer Handbook of Experimental Solid Mechanics. Springer Handbooks. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-30877-7_36

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