Abstract
In this chapter an outline of the theoretical foundations for the experimental technique of thermoelastic stress analysis is presented, followed by a description of the equipment, test materials, and methods required to perform an analysis. Thermoelastic stress analysis is a technique by which maps of a linear combination of the in-plane surface stresses of a component are obtained by measuring the surface temperature changes induced by time-varying stress/strain distributions using a sensitive infrared detector. Experimental considerations relating to issues such as shielding from background radiation, edge effects, motion compensation, detector setup, calibration, and data interpretation are discussed. The potential of the technique is illustrated using a number of examples that involve isotropic as well as orthotropic materials, fracture mechanics, separation of component stresses, and vibration analysis. Applications of the method to situations involving residual stresses, elevated temperatures, and variable amplitude loading are also considered.
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- CCD:
-
charge-coupled device
- DC:
-
direct current
- FEM:
-
finite element modeling
- FFT:
-
fast Fourier transform
- MPODM:
-
multipoint overdeterministic method
- PMMA:
-
polymethyl methacrylate
- PVC:
-
polyvinyl chloride
- S/N:
-
signal to noise
- SPATE:
-
stress pattern analysis by thermal emissions
- TERSA:
-
thermal evaluation for residual stress analysis
- TSA:
-
thermoelastic stress analysis
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Greene, R.J., Patterson, E.A., Rowlands, R.E. (2008). Thermoelastic Stress Analysis. In: Sharpe, W. (eds) Springer Handbook of Experimental Solid Mechanics. Springer Handbooks. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-30877-7_26
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