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High Volume Manufacturing and Field Stability of MEMS Products

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Springer Handbook of Nanotechnology

Part of the book series: Springer Handbooks ((SHB))

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Abstract

Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost – a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are significant factors in MEMS product cost. These devices have extremelyhigh surface/volume ratios, so performance and stability may depend on the control of surface characteristics after packaging. Looking into the future, the competitive advantage of IC suppliers will decrease as small companies learn to integrate MEMS/NEMS devices on CMOS foundry wafers. Packaging challenges still remain, because most MEMS/NEMS products must interact with the environment without degrading stability or reliability. Generic packaging solutions are unlikely. However, packaging subcontractors recognize that MEMS/NEMS is a growth opportunity. They will spread the overhead burden of high-capital-cost-facilities by developing flexible processes in order to package several types of moderate volume integrated MEMS/NEMS products on the same equipment.

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Abbreviations

ASA:

anti-stiction agent

CVD:

chemical vapor deposition

DLP:

digital light processing

DMD:

digital micromirror device

EDP:

ethylene diamine pyrocatechol

ESD:

electrostatic discharge

FMEA:

failure mode effect analysis

HF:

hydrofluoric acid

IC:

integrated circuit

LCC:

leadless chip carrier

MAP:

manifold absolute pressure

MEMS:

microelectromechanical systems

NEMS:

nanoelectromechanical systems

PA:

plasminogen activator

RF:

radiofrequency

SAM:

self-assembling monolayer

SRAM:

static random access memory

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  1. Micromachined Products Division, Analog Devices, Inc., 21 Osborn Street, 02139, Cambridge, MA, USA

    Jack Martin Dr.

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  1. Nanotribology Laboratory for Information Storage and MEMS/NEMS, The Ohio State University, 206 W. 18th Avenue, 43210-1107, Columbus, OH, USA

    Bharat Bhushan Prof.

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Martin, J. (2004). High Volume Manufacturing and Field Stability of MEMS Products. In: Bhushan, B. (eds) Springer Handbook of Nanotechnology. Springer Handbooks. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-29838-X_36

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