Overview
Microelectromechanical systems (MEMS) devices are sensors and actuators with the mechanical movement as a major performance measure. Therefore, the performance of a MEMS device can be strongly affected by thermal stresses resulting from constraining interactions among device’s multiple layers and between the package and the device. Such an effect is a main design and manufacturing consideration for almost every MEMS device and package. However, thermal stress is not always an undesirable effect. Thermal stress can be used to create novel configurations during MEMS fabrication and assembly. Various three-dimensional shapes can be formed by stress-induced deformations and displacements. Thermal stress can be used to generate mechanical movements for a MEMS actuator. The MEMS thermal actuator is commonly used with actuation controlled by heating and cooling configurations with asymmetric materials or temperature distributions or asymmetric geometry. Thermal stress can also be...
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References
Lee YC (2008) Microelectromechanical systems and packaging. Chapter 17. In: Lu D, Wong CP (eds) Materials for advanced packaging. Springer, New York, pp 601–627
Lee YC (2007) MEMS packaging and reliability. Chapter 11. In: Suhir E, Lee YC, Wong CP (eds) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging, vol II. Springer, New York, pp 299–320
Madou MJ (2002) Fundamentals of microfabrication: the science of miniaturization. CRC Press, Boca Raton
Senturia SD (2000) Microsystem design (Hardcover). Springer, Guildford
Zhang X, Park SB, Judy MW (2007) Accurate assessment of packaging stress effects on MEMS sensors by measurement and sensor–package interaction simulations. J Microelectromech Syst 16:639–649
Reines I, Pillans B, Rebeiz G (2011) Thin-film aluminum RF MEMS switched capacitors with stress tolerance and temperature stability. J Microelectromech Syst 20(1):193–203
Lin J, Yu F, Tai YC (2010) Cracking pressure control of parylene check valve using slanted tensile tethers. In: Technical digest 23rd IEEE international conference on MicroElectroMechanical systems, Hongkong, 24–28 Jan 2010, pp 1107–1110
Chow EM, Chua C, Hantschel T, Van Schuylenbergh K, Fork DK (2006) Pressure contact micro-springs in small pitch flip-chip packages. IEEE Trans Compon Packag Technol 29(4):796–803
Liu C (2006) Thermal sensing and actuation in foundations of MEMS. Chapter 5. Pearson Prentice Hall, Upper Saddle River
Eniko T, Lazarov K (2005) Micro-mechanical switch array for meso-scale actuation. Sensor Actuator A 121:282–293
Girbau D, Pradell L, Lázaro A, Nebot A (2007) Electrothermally actuated RF MEMS switches suspended on a low-resistivity substrate. J Microelectromech Syst 16(5):1061–1070
Brown G, Li L, Bauer R, Liu J, Uttamchandani D (2010) A two-axis hybrid MEMS scanner incorporating electrothermal and electrostatic actuators. In: 2010 international conference on optical MEMS & nanophotonics, Sapporo, Japan, pp 115–116
Jain A, Kopa A, Pan Y, Fedder GK, Xie H (2004) A two-axis electrothermal micromirror for endoscopic optical coherence tomography. IEEE J Sel Top Quantum Electron 10(3):636–642
Ishikawa K, Zhang J, Tuantranont A, Bright VM, Lee YC (2002) An integrated micro-optical system for laser-to-fiber active alignment. In: The 15th IEEE international conference on micro electro mechanical systems (MEMS 2002), Las Vegas, 20–24 Jan 2002, pp 491–494
Scott S, Scuderi M, Peroulis D (2012) A 600 °C wireless multimorph-based capacitive MEMS for component health monitoring. In: IEEE 25th international conference on MEMS, Paris, pp 496–499
Lee S, Wallis TM, Moreland J, Kabos P, Lee YC (2007) Dielectric asymmetric trilayer cantilever probe for calorimetric high frequency field imaging. J Microelectromech Syst 16(1):78–85
Gunter RL, Zhine R, Delinger WG, Manygoats K, Kooser A, Porter TL (2004) Investigation of DNA sensing using piezoresistive microcantilever probes. IEEE Sens J 4(4):430–433
Acknowledgements
The authors are supported by the DARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT) through the DARPA N/MEMS S&T Fundamentals Program (N66001-10-1-4007) and DARPA Micro Cryogenic Cooling (MCC) Program (W31P4Q-10-1-0004).
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Wang, Y., Kong, M., Lee, YC. (2014). Thermal Stress in MEMS. In: Hetnarski, R.B. (eds) Encyclopedia of Thermal Stresses. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-2739-7_275
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DOI: https://doi.org/10.1007/978-94-007-2739-7_275
Publisher Name: Springer, Dordrecht
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