Encyclopedia of Thermal Stresses

2014 Edition
| Editors: Richard B. Hetnarski

Thermal Stress in MEMS

Reference work entry
DOI: https://doi.org/10.1007/978-94-007-2739-7_275


Microelectromechanical systems (MEMS) devices are sensors and actuators with the mechanical movement as a major performance measure. Therefore, the performance of a MEMS device can be strongly affected by thermal stresses resulting from constraining interactions among device’s multiple layers and between the package and the device. Such an effect is a main design and manufacturing consideration for almost every MEMS device and package. However, thermal stress is not always an undesirable effect. Thermal stress can be used to create novel configurations during MEMS fabrication and assembly. Various three-dimensional shapes can be formed by stress-induced deformations and displacements. Thermal stress can be used to generate mechanical movements for a MEMS actuator. The MEMS thermal actuator is commonly used with actuation controlled by heating and cooling configurations with asymmetric materials or temperature distributions or asymmetric geometry. Thermal stress can also be...

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The authors are supported by the DARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT) through the DARPA N/MEMS S&T Fundamentals Program (N66001-10-1-4007) and DARPA Micro Cryogenic Cooling (MCC) Program (W31P4Q-10-1-0004).


  1. 1.
    Lee YC (2008) Microelectromechanical systems and packaging. Chapter 17. In: Lu D, Wong CP (eds) Materials for advanced packaging. Springer, New York, pp 601–627Google Scholar
  2. 2.
    Lee YC (2007) MEMS packaging and reliability. Chapter 11. In: Suhir E, Lee YC, Wong CP (eds) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging, vol II. Springer, New York, pp 299–320Google Scholar
  3. 3.
    Madou MJ (2002) Fundamentals of microfabrication: the science of miniaturization. CRC Press, Boca RatonGoogle Scholar
  4. 4.
    Senturia SD (2000) Microsystem design (Hardcover). Springer, GuildfordGoogle Scholar
  5. 5.
    Zhang X, Park SB, Judy MW (2007) Accurate assessment of packaging stress effects on MEMS sensors by measurement and sensor–package interaction simulations. J Microelectromech Syst 16:639–649Google Scholar
  6. 6.
    Reines I, Pillans B, Rebeiz G (2011) Thin-film aluminum RF MEMS switched capacitors with stress tolerance and temperature stability. J Microelectromech Syst 20(1):193–203Google Scholar
  7. 7.
    Lin J, Yu F, Tai YC (2010) Cracking pressure control of parylene check valve using slanted tensile tethers. In: Technical digest 23rd IEEE international conference on MicroElectroMechanical systems, Hongkong, 24–28 Jan 2010, pp 1107–1110Google Scholar
  8. 8.
    Chow EM, Chua C, Hantschel T, Van Schuylenbergh K, Fork DK (2006) Pressure contact micro-springs in small pitch flip-chip packages. IEEE Trans Compon Packag Technol 29(4):796–803Google Scholar
  9. 9.
    Liu C (2006) Thermal sensing and actuation in foundations of MEMS. Chapter 5. Pearson Prentice Hall, Upper Saddle RiverGoogle Scholar
  10. 10.
    Eniko T, Lazarov K (2005) Micro-mechanical switch array for meso-scale actuation. Sensor Actuator A 121:282–293Google Scholar
  11. 11.
    Girbau D, Pradell L, Lázaro A, Nebot A (2007) Electrothermally actuated RF MEMS switches suspended on a low-resistivity substrate. J Microelectromech Syst 16(5):1061–1070Google Scholar
  12. 12.
    Brown G, Li L, Bauer R, Liu J, Uttamchandani D (2010) A two-axis hybrid MEMS scanner incorporating electrothermal and electrostatic actuators. In: 2010 international conference on optical MEMS & nanophotonics, Sapporo, Japan, pp 115–116Google Scholar
  13. 13.
    Jain A, Kopa A, Pan Y, Fedder GK, Xie H (2004) A two-axis electrothermal micromirror for endoscopic optical coherence tomography. IEEE J Sel Top Quantum Electron 10(3):636–642Google Scholar
  14. 14.
    Ishikawa K, Zhang J, Tuantranont A, Bright VM, Lee YC (2002) An integrated micro-optical system for laser-to-fiber active alignment. In: The 15th IEEE international conference on micro electro mechanical systems (MEMS 2002), Las Vegas, 20–24 Jan 2002, pp 491–494Google Scholar
  15. 15.
    Scott S, Scuderi M, Peroulis D (2012) A 600 °C wireless multimorph-based capacitive MEMS for component health monitoring. In: IEEE 25th international conference on MEMS, Paris, pp 496–499Google Scholar
  16. 16.
    Lee S, Wallis TM, Moreland J, Kabos P, Lee YC (2007) Dielectric asymmetric trilayer cantilever probe for calorimetric high frequency field imaging. J Microelectromech Syst 16(1):78–85Google Scholar
  17. 17.
    Gunter RL, Zhine R, Delinger WG, Manygoats K, Kooser A, Porter TL (2004) Investigation of DNA sensing using piezoresistive microcantilever probes. IEEE Sens J 4(4):430–433Google Scholar

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© Springer Science+Business Media Dordrecht 2014

Authors and Affiliations

  1. 1.DARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT), Department of Mechanical EngineeringUniversity of ColoradoBoulderUSA