Reference Work Entry

Encyclopedia of Thermal Stresses

pp 5237-5248

Thermal Stress in MEMS

  • Yunda WangAffiliated withDARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT), Department of Mechanical Engineering, University of Colorado Email author 
  • , Ming KongAffiliated withDARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT), Department of Mechanical Engineering, University of Colorado
  • , Yung-Chen LeeAffiliated withDARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT), Department of Mechanical Engineering, University of Colorado

Overview

Microelectromechanical systems (MEMS) devices are sensors and actuators with the mechanical movement as a major performance measure. Therefore, the performance of a MEMS device can be strongly affected by thermal stresses resulting from constraining interactions among device’s multiple layers and between the package and the device. Such an effect is a main design and manufacturing consideration for almost every MEMS device and package. However, thermal stress is not always an undesirable effect. Thermal stress can be used to create novel configurations during MEMS fabrication and assembly. Various three-dimensional shapes can be formed by stress-induced deformations and displacements. Thermal stress can be used to generate mechanical movements for a MEMS actuator. The MEMS thermal actuator is commonly used with actuation controlled by heating and cooling configurations with asymmetric materials or temperature distributions or asymmetric geometry. Thermal stress can also ...

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