Solder Paste Printing
Application of the solder material on the circuit carrier in electronics production.
The solder material is applied as a medium for connecting the electronic components on the circuit board in surface mount technology. The paste material is applied either by using a stencil or screen on two-dimensional circuit carriers. The main task of this process step is to make available appropriate volume of solder material for a reliable post-soldering process.
Theory and Application
The solder paste printing is the first process step in the electronics production. Solder paste which is generally a suspension of metal particles in flux material is used as interconnection material. The flux material is a temporary adhesive consisting of activators, resins, and acid solvents. This holds the components until the soldering process melts the solder and makes an electrical and mechanical...
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