CIRP Encyclopedia of Production Engineering

2019 Edition
| Editors: Sami Chatti, Luc Laperrière, Gunther Reinhart, Tullio Tolio

Solder Paste Printing

  • Aarief Syed-KhajaEmail author
  • Jörg Franke
Reference work entry



Application of the solder material on the circuit carrier in electronics production.

Extended Definition

The solder material is applied as a medium for connecting the electronic components on the circuit board in surface mount technology. The paste material is applied either by using a stencil or screen on two-dimensional circuit carriers. The main task of this process step is to make available appropriate volume of solder material for a reliable post-soldering process.

Theory and Application


The solder paste printing is the first process step in the electronics production. Solder paste which is generally a suspension of metal particles in flux material is used as interconnection material. The flux material is a temporary adhesive consisting of activators, resins, and acid solvents. This holds the components until the soldering process melts the solder and makes an electrical and mechanical...

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Copyright information

© CIRP 2019

Authors and Affiliations

  1. 1.Institute for Factory Automation and Production Systems (FAPS)Friedrich-Alexander-University of Erlangen-Nuremberg (FAU)NurembergGermany
  2. 2.Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KGHanauGermany

Section editors and affiliations

  • Joerg Krueger
    • 1
  • Kirsten Tracht
  1. 1.IWFTechnische Universität BerlinBerlinGermany