CIRP Encyclopedia of Production Engineering

2019 Edition
| Editors: Sami Chatti, Luc Laperrière, Gunther Reinhart, Tullio Tolio

Solder Paste Printing

  • Aarief Syed-KhajaEmail author
  • Jörg Franke
Reference work entry
DOI: https://doi.org/10.1007/978-3-662-53120-4_16835

Synonyms

Definition

Application of the solder material on the circuit carrier in electronics production.

Extended Definition

The solder material is applied as a medium for connecting the electronic components on the circuit board in surface mount technology. The paste material is applied either by using a stencil or screen on two-dimensional circuit carriers. The main task of this process step is to make available appropriate volume of solder material for a reliable post-soldering process.

Theory and Application

Theory

The solder paste printing is the first process step in the electronics production. Solder paste which is generally a suspension of metal particles in flux material is used as interconnection material. The flux material is a temporary adhesive consisting of activators, resins, and acid solvents. This holds the components until the soldering process melts the solder and makes an electrical and mechanical...

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References

  1. Burkhalter G, Leak E, Shea C, Tripp R, Wade G (2007) Transfer efficiencies in stencil printing. In: Proceedings of i-Connect007, SMT007, May 2007. http://smt.iconnect007.com/index.php/article/45167/transfer-efficiencies-in-stencil-printing/45170/?skin=smt. Accessed 14 May 2018
  2. Coleman WE (2001) Stencil technology and design guidelines for print performance. Circuits Assembly 12:38Google Scholar
  3. Coleman WE, Burgess MR (2006) Stencil performance comparison/AMTX electroform vs laser-cut electroform nickel foil. In: SMTA International 2006 and Assembly Technology Expo: “the power is you”, September 24–28, 2006, Rosemont, Illinois, USA. Conference proceedings of the surface mount technology association, vol 1. Curran Associates, Red Hook, pp. 51–57Google Scholar
  4. Fleck I, Chouta P (2003) A new dimension in stencil print optimization. J Surf Mount Technol 16(1):24Google Scholar
  5. IPC (2007) IPC-7525A stencil design Guidelines. IPC, BannockburnGoogle Scholar
  6. IPC (2011) IPC-7525B stencil design guidelines, 3rd edn. IPC, BannockburnGoogle Scholar
  7. IPC (2012) IPC J-STD-005A requirements for soldering pastes. IPC, BannockburnGoogle Scholar

Copyright information

© CIRP 2019

Authors and Affiliations

  1. 1.Institute for Factory Automation and Production Systems (FAPS)Friedrich-Alexander-University of Erlangen-Nuremberg (FAU)NurembergGermany
  2. 2.Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KGHanauGermany

Section editors and affiliations

  • Joerg Krueger
    • 1
  • Kirsten Tracht
  1. 1.IWFTechnische Universität BerlinBerlinGermany