CIRP Encyclopedia of Production Engineering

Living Edition
| Editors: The International Academy for Production Engineering, Sami Chatti, Tullio Tolio

Electric Test

  • Alexander Hensel
  • Ping Xu
  • Daniel Graef
  • Joerg FrankeEmail author
Living reference work entry
DOI: https://doi.org/10.1007/978-3-642-35950-7_16841-1

Definition

The application of an electric test can verify the functionality of an assembled circuit board.

Several tests are used: in-circuit test, flying probe testers, and run-in/burn-in test. The in-circuit test describes a test pattern where a final assembled circuit board is tested in order to identify malfunctions. The flying probe was developed based on bed-of-nail (BON) with probes replacing the pins. The run-in/burn-in test is a quality screening technique for electronic components under electrical and thermal stress, used for early failure detection.

Theory and Application

In-Circuit Test

Theory: In in-circuit test a testing plate with spring-loaded testing probes is used to contact every essential electrical pad. Hence, the performance of the mounted devices can be measured without interference from nearby components. Specified values like resistance and capacitance are as well measured as the general operation of ICs or analogue devices. Furthermore, the programming of...
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References

  1. Backwell GR (2000) The electronic packaging handbook. CRC Press, Boca RatonGoogle Scholar
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  3. Feldmann K (2009) Montage in der Leistungselektronik für globale Märkte – Design, Konzepte, Strategien [Assembly of power electronics for global markets – design, concepts strategies], 1st edn. Springer, Berlin/Heidelberg (in German)Google Scholar
  4. Geiger W, Kotte W (2008) Handbuch Qualität – Grundlagen und Elemente des Qualitätsmanagements: Systeme – Perspektiven [Handbook of quality – basics and elements of quality management: systems – perspectives], 5th edn. Vieweg Verlag, Wiesbaden (in German)Google Scholar
  5. Hertweck M (1997) Prüfverfahren für die Serienfertigung feldbusfähiger Automatisierungskomponenten [Testing process for the production of fieldbus enabled automization components]. Herbert Utz Verlag Wissenschaft, München (in German)Google Scholar
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  7. Jowett CE (1972) Compatibility and Testing of Electronic Components. Butterworth & Co, LondonGoogle Scholar
  8. Khandpur RS (2005) Printed circuit boards: design, fabrication, assembly and testing. Tata McGraw-Hill, New DelhiGoogle Scholar
  9. Pham H (ed) (2008) Recent advances in reliability and quality in design. Springer, LondonzbMATHGoogle Scholar

Copyright information

© CIRP 2019

Authors and Affiliations

  • Alexander Hensel
    • 1
  • Ping Xu
    • 1
  • Daniel Graef
    • 1
  • Joerg Franke
    • 1
    Email author
  1. 1.Institute for Factory Automation and Production Systems (FAPS)Friedrich-Alexander-University of Erlangen-Nuremberg (FAU)NurembergGermany

Section editors and affiliations

  • Joerg Krueger
    • 1
  • Kirsten Tracht
  1. 1.IWFTechnische Universität BerlinBerlinGermany