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CIRP Encyclopedia of Production Engineering pp 1578–1581Cite as

SMD Component Placement

  • Reference work entry
  • First Online:

  • 106 Accesses

Synonyms

Pick and place; Surface mounted device (SMD) placement

Definition

The placement of surface mount technology (SMT) components on printed circuit boards (PCB) and its assembly task is defined as follows:

  • Grip the right component from the pick-up position (respectively feeder)

  • Place the component on the right position (target position) on the surface of printed circuit boards (PCB) with appropriate precision and accuracy

Extended Definition

The process of placing a surface mounted device (SMD) is structured in following steps:

  1. 1.

    Feeding

    1. (a)

      Depending on component shape and according to the packaging type of the components (paper or plastic tape and reel, tray, tubes, and bulk case), there exist different individual feeder types.

  2. 2.

    Gripping

    1. (a)

      The components are gripped at the top-side by individually designed vacuum grippers respectively nozzles. These are customized according to the shape and weight of the component to hold the components reliable even at high acceleration...

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References

  • Feldmann K, Schöppner V, Spur G (eds) (2014) Handbuch Fügen, Handhaben, Montieren [Handbook joining, handling, assembling]. In: Edition Handbuch der Fertigungstechnik [Production engineering handbook], vol 5. Hanser, München (in German)

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  • Klein Wassink R, Verguld M (1995) Manufacturing techniques for surface mounted assemblies. Electrochemical Publications, British Isles

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  • Scheel W, Hanke H-J (eds) (1999) Montage [Assembly]. Baugruppentechnologie der Elektronik [Electronics assembly technology]. Verlag Technik, Berlin (in German)

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  • Wohlrabe H (2009). Qualitätsoptimierung bei der Fertigung Elektronischer Baugruppen Mittels Statistischer Analysemethoden [Quality optimization in electronics production by means of statistical analysis methods]. In: System integration in electronic packaging, vol 7. Detert, Templin (in German)

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  • Wormuth D, Zapf J (2001) Grundlagen der Surface Mount Technology [Basics of surface mount technology]. Siemens Dematic AG, München (in German)

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Author information

Authors and Affiliations

  1. Institute for Factory Automation and Production Systems (FAPS), Friedrich-Alexander-University of Erlangen-Nuremberg (FAU), Nuremberg, Germany

    Michael Pfeffer & Jörg Franke

Authors
  1. Michael Pfeffer
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  2. Jörg Franke
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Corresponding author

Correspondence to Michael Pfeffer .

Editor information

Editors and Affiliations

  1. National Engineering School of Monastir (ENIM), University of Monastir, Monastir, Tunisia

    Sami Chatti

  2. Mechanical Engineering, Université du Québec à Trois-Rivières, Trois-Rivières, QC, Canada

    Luc Laperrière

  3. Institute for Machine Tools and Industrial Management (iwb), Technical University of Munich (TUM), Garching, Germany

    Gunther Reinhart

  4. ITIA Institute of Industrial Technologies and Automation, CNR National Research Council, Milan, Italy

    Tullio Tolio

Section Editor information

  1. No affiliation provided

    Joerg Krueger Ing.

  2. No affiliation provided

    Kirsten Tracht

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© 2019 CIRP

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Cite this entry

Pfeffer, M., Franke, J. (2019). SMD Component Placement. In: Chatti, S., Laperrière, L., Reinhart, G., Tolio, T. (eds) CIRP Encyclopedia of Production Engineering. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-53120-4_16836

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