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CIRP Encyclopedia of Production Engineering pp 1581–1583Cite as

Solder Paste Printing

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Synonyms

Solder paste application; Solder application; Solder printing

Definition

Application of the solder material on the circuit carrier in electronics production.

Extended Definition

The solder material is applied as a medium for connecting the electronic components on the circuit board in surface mount technology. The paste material is applied either by using a stencil or screen on two-dimensional circuit carriers. The main task of this process step is to make available appropriate volume of solder material for a reliable post-soldering process.

Theory and Application

Theory

The solder paste printing is the first process step in the electronics production. Solder paste which is generally a suspension of metal particles in flux material is used as interconnection material. The flux material is a temporary adhesive consisting of activators, resins, and acid solvents. This holds the components until the soldering process melts the solder and makes an electrical and mechanical...

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References

  • Burkhalter G, Leak E, Shea C, Tripp R, Wade G (2007) Transfer efficiencies in stencil printing. In: Proceedings of i-Connect007, SMT007, May 2007. http://smt.iconnect007.com/index.php/article/45167/transfer-efficiencies-in-stencil-printing/45170/?skin=smt. Accessed 14 May 2018

  • Coleman WE (2001) Stencil technology and design guidelines for print performance. Circuits Assembly 12:38

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  • Coleman WE, Burgess MR (2006) Stencil performance comparison/AMTX electroform vs laser-cut electroform nickel foil. In: SMTA International 2006 and Assembly Technology Expo: “the power is you”, September 24–28, 2006, Rosemont, Illinois, USA. Conference proceedings of the surface mount technology association, vol 1. Curran Associates, Red Hook, pp. 51–57

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  • Fleck I, Chouta P (2003) A new dimension in stencil print optimization. J Surf Mount Technol 16(1):24

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  • IPC (2007) IPC-7525A stencil design Guidelines. IPC, Bannockburn

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  • IPC (2011) IPC-7525B stencil design guidelines, 3rd edn. IPC, Bannockburn

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  • IPC (2012) IPC J-STD-005A requirements for soldering pastes. IPC, Bannockburn

    Google Scholar 

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Author information

Authors and Affiliations

  1. Institute for Factory Automation and Production Systems (FAPS), Friedrich-Alexander-University of Erlangen-Nuremberg (FAU), Nuremberg, Germany

    Aarief Syed-Khaja & Jörg Franke

  2. Heraeus Electronics, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany

    Aarief Syed-Khaja

Authors
  1. Aarief Syed-Khaja
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  2. Jörg Franke
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Corresponding author

Correspondence to Aarief Syed-Khaja .

Editor information

Editors and Affiliations

  1. National Engineering School of Monastir (ENIM), University of Monastir, Monastir, Tunisia

    Sami Chatti

  2. Mechanical Engineering, Université du Québec à Trois-Rivières, Trois-Rivières, QC, Canada

    Luc Laperrière

  3. Institute for Machine Tools and Industrial Management (iwb), Technical University of Munich (TUM), Garching, Germany

    Gunther Reinhart

  4. ITIA Institute of Industrial Technologies and Automation, CNR National Research Council, Milan, Italy

    Tullio Tolio

Section Editor information

  1. No affiliation provided

    Joerg Krueger Ing.

  2. No affiliation provided

    Kirsten Tracht

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© 2019 CIRP

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Cite this entry

Syed-Khaja, A., Franke, J. (2019). Solder Paste Printing. In: Chatti, S., Laperrière, L., Reinhart, G., Tolio, T. (eds) CIRP Encyclopedia of Production Engineering. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-53120-4_16835

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