Volume 7, Issue 4 | Microsystem Technologies

Microsystem Technologies

Micro- and Nanosystems Information Storage and Processing Systems

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Volume 7, Issue 4

November 2001

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13 articles in this issue

Preface
Pages: 137 - 137
Sensors and smart electronics in harsh environment applications
W. R. Fahrner
R. Job
M. Werner
Pages: 138 - 144
Highly parallel mass fabrication and assembly of microdevices
W. Ehrfeld
M. Begemann
M. Nienhaus
Pages: 145 - 150
Dicing challenges in microelectronics and micro electro-mechanical systems (MEMS)
H. H. Gatzen
Pages: 151 - 154
Plastic reshaping of silicon microstructures: process, characterization and application
E. Gärtner
J. Frühauf
E. Jänsch
Pages: 155 - 160
Internal stresses and lifetime evaluation of PECVD isolating layers
A. Dommann
N. Herres
B. Stämpfli
Pages: 161 - 164
Shape memory microactuators
S. Büttgenbach
S. Bütefisch
A. Wogersien
Pages: 165 - 170
Micromechanical three-axial tactile force sensor for micromaterial characterisation
S. Bütefisch
S. Büttgenbach
U. Brand
Pages: 171 - 174
Fatigue of directly wafer-bonded silicon under static and cyclic loading
J. Bagdahn
M. Petzold
Pages: 175 - 182
Micro materials modeling in MINIMOS-NT
V. Palankovski
S. Selberherr
Pages: 183 - 187
Integration of micro-mechatronics in automotive applications
F. Ansorge
K.-F. Becker
H. Reichl
Pages: 188 - 190
Micro-metalforming with silicon dies
J. Böhm
A. Schubert
T. Burkhardt
Pages: 191 - 195
Application of electroplating in MEMS-micromachining exemplified by a microrelay
M. Becker
D. Lütke Notarp
B. Michel
Pages: 196 - 202