Skip to main content
Log in

Editorial board

Interim Editor-in-Chief

Quanxi Jia, Functional Materials; University at Buffalo (SUNY), USA

Associate Editor

Susmita Bose, Biomaterials; Washington State University, USA

Associate Editor

Suveen N. Mathaudhu, Metallic Materials, Bulk Processing, Mechanical Behavior; Colorado School of Mines, USA

Associate Editor

Sarah E. Morgan, Polymers and Organic Materials; The University of Southern Mississippi, USA

Editorial Advisor
Ramamoorthy Ramesh, Inorganic Functional Materials, Quantum Materials, Epitaxy; Rice University, Houston, USA

Principal Editors

Kantesh Balani, Biomaterials, High-temperature Ceramics; Indian Institute of Technology, Kanpur, India

Amit Bandyopadhyay, Hard Biomaterials, Additive Manufacturing; Washington State University, USA

Ricardo H.R. Castro, Interfaces Thermodynamics, Calorimetry, Nanoceramics; Lehigh University, USA

Jinju Chen, Soft Materials/Thin Films, Nanoindentation; Newcastle University, UK

Xiaobo Chen, Photocatalysis, Batteries; University of Missouri - Kansas City, USA

Sung-Yoon Chung, Mechanical Behavior, Electromechanical Energy Storage; KAIST, South Korea

Franz Faupel, Functional Nanomaterials; Universität Kiel, Germany

Michael C. Gao, High Entropy Alloys, Computational Materials Science; National Energy Technology Laboratory, USA

Sourabh Ghosh, Silk, Tissue Engineering, Bioprinting; Indian Institute of Technology Delhi, India

Xiaodan Gu, University of Southern Mississippi, USA

Erik G. Herbert, Nanoindentation, Small-scale Mechanical Behavior; Michigan Technological University, USA

Kalpana Katti, North Dakota State University, USA

Edson Roberto Leite, Materials Chemistry, Nanocrystals, Synthesis; Brazilian Nanotechnology National Laboratory, Brazil

Lei Liu, Semiconductors, Electronic Structure, Spectroscopy; Changchun Institute of Optics, Fine Mechanics, and Physics, China

Takahito Ohmura, Nanomechanical Characterization, Lattice Defects; National Institute for Materials Science, Japan

Alice E. Perrin, Magnetic and Speciality Alloy Design; Oak Ridge National Laboratory, USA

Jayakanth Raichandran, University of Southern California, USA

Christopher J.K. Richardson, Quantum and Optoelectronic Materials; University of Maryland, USA

Javier Rodriguez Varela, Nanomaterials, Electrochemical Energy; Cinvestav Unidad Saltillo, Mexico

Ralph Spolenak, Size Effects in Materials, Micro 3D-Printing; ETH, Zurich, Switzerland

Peng Tao, Solar/thermal Energy Materials, Polymer Composites; Shanghai Jiao Tong University, China

Venu Varanasi, Amorphous Materials, Biomimetics, Bioprinting; University of Texas at Arlington, USA , USA

Chongmin Wang, Energy Storage, Microscopy, In-situ/Operando Technique; Pacific Northwest National Laboratory, USA

William Yi Wang, Lightweight Materials, Computational Materials Science; ICME, Northwestern Polytechnical University, China

Man Hoi Wong, Hong Kong University of Science and Technology, China

Xingcheng Xiao, Energy Storage Materials, AFM, Nanoindentation; General Motors, USA

Jinkyoung Yoo, Los Alamos National Laboratory, USA

Yanchun Zhou, Structural Ceramics, Electronic Structure; Aerospace Research Institute of Materials and Processing Technology, China

Yu Zou, Metallic Materials, Mechanical Behavior, Nanomechanics; University of Toronto, Canada

Navigation