Electrical characterization of integrated passive devices using thin film technology for 3D integration Xin SunYun-hui ZhuYu-feng Jin OriginalPaper 10 April 2013 Pages: 235 - 243
Low temperature Si/Si wafer direct bonding using a plasma activated method Dong-ling LiZheng-guo ShangZhi-yu Wen OriginalPaper 10 April 2013 Pages: 244 - 251
A planar capacitive sensor for 2D long-range displacement measurement Jian-ping YuWen WangZi-chen Chen OriginalPaper 10 April 2013 Pages: 252 - 257
Measurement of wireless pressure sensors fabricated in high temperature co-fired ceramic MEMS technology Ji-jun XiongShi-jun ZhengQiu-lin Tan OriginalPaper 10 April 2013 Pages: 258 - 263
High-precision low-power quartz tuning fork temperature sensor with optimized resonance excitation Jun XuXin LiHai-bo Xu OriginalPaper 10 April 2013 Pages: 264 - 273
A trapezoidal cantilever density sensor based on MEMS technology Li-bo ZhaoLong-qi XuZhuang-de Jiang OriginalPaper 10 April 2013 Pages: 274 - 278
High Q, high frequency, high overtone bulk acoustic resonator with ZnO films Meng-wei LiuMing-bo ZhuCheng-hao Wang OriginalPaper 10 April 2013 Pages: 279 - 282
Resin-bonded NdFeB micromagnets for integration into electromagnetic vibration energy harvesters Pei-hong WangKai TaoGui-fu Ding OriginalPaper 10 April 2013 Pages: 283 - 287
Ka-band ultra low voltage miniature sub-harmonic resistive mixer with a new broadside coupled Marchand balun in 0.18-μm CMOS technology Ge-liang YangZhi-gong WangZhu Li OriginalPaper 10 April 2013 Pages: 288 - 295
Predictive current control of multi-pulse flexible-topology thyristor AC-DC converter Da-min ZhangShi-tao WangZheng-yu Lu OriginalPaper 10 April 2013 Pages: 296 - 310
