Stable optical emission from annealed poly (p-phenylene vinylene) derivative films containing oxadiazole F. KongX. L. WuG. G. Siu OriginalPaper Pages: 1689 - 1692
Thermosonic bonding of gold wire onto silver bonding layer on the bond pads of chips with copper interconnects Cheng-Li ChuangJong-Ning Aoh OriginalPaper Pages: 1693 - 1700
Effects of oxygen in Ni films on Ni-induced lateral crystallization of amorphous silicon films at various temperatures You-Da LinYewchung Sermon Wu OriginalPaper Pages: 1708 - 1711
InAs-based p-n homojunction diodes: Doping effects and impact of doping on device parameters Changhyun YiTong-Ho KimApril S. Brown OriginalPaper Pages: 1712 - 1714
Nonlinear optical dynamics of glass-embedded silver nanoparticles S. LysenkoJ. JimenezH. Liu OriginalPaper Pages: 1715 - 1721
Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates J. S. HwangM. J. YimK. W. Paik OriginalPaper Pages: 1722 - 1727
Studies of the optoelectronic properties of ZnO thin films R. GhoshS. FujiharaD. Basak OriginalPaper Pages: 1728 - 1733
Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy X. ChenM. LiD. L. Mao OriginalPaper Pages: 1734 - 1739
Effect of Al trace dimension on electromigration failure time of flip-chip solder joints S. H. ChiuChih ChenD. J. Yao OriginalPaper Pages: 1740 - 1744
Influence of Cu content on compound formation near the chip side for the flip-chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump during aging Guh-Yaw JangJeng-Gong DuhJen-Chuan Chen OriginalPaper Pages: 1745 - 1754
Revealing the nucleation and growth mechanism of a novel solder developed from Sn-3.5Ag-0.5Cu nanoparticles by a chemical reduction method Li-Yin HsiaoJenq-Gong Duh OriginalPaper Pages: 1755 - 1760
Reliability issues in Pb-free solder joint miniaturization Zhiheng HuangPaul P. ConwayMathias Minkus OriginalPaper Pages: 1761 - 1772