Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests T. I. ShihY. C. LinTom Hsu OriginalPaper Pages: 1773 - 1780
In-situ observation of material migration in flip-chip solder joints under current stressing C. M. TsaiYi-Shao LaiC. R. Kao OriginalPaper Pages: 1781 - 1786
Development of a high-strength high-conductivity Cu-Ni-P alloy. Part I: Characterization of precipitation products M. MurayamaA. BelyakovT. Kimura OriginalPaper Pages: 1787 - 1792
Compositionally graded interface for passivation of HgCdTe photodiodes R. PalA. MalikH. P. Vyas OriginalPaper Pages: 1793 - 1800
Atomic bonding and properties of Al-Cu alloy with ϑ(Al2Cu) Yingjun GaoQifeng MoChuanggao Huang OriginalPaper Pages: 1801 - 1805
Epitaxial growth of GaN layers on metallic TiN buffer layers Yu UchidaKazuhiro ItoMasanori Murakami OriginalPaper Pages: 1806 - 1811
Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad Ahmed SharifY. C. Chan OriginalPaper Pages: 1812 - 1817
Depressing effect of 0.2wt.%Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging Feng-Jiang WangFeng GaoYi-Yu Qian OriginalPaper Pages: 1818 - 1824
Electroless nickel plating process model for plated-through-hole board manufacturing R. TennoK. KantolaA. Tenno OriginalPaper Pages: 1825 - 1836
Poly- and single-crystalline h-GaN grown on SiCN/Si(100) and SiCN/Si(111) substrates by MOCVD Shiuan-Ho ChangYean-Kuen FangChin-Yung Liang OriginalPaper Pages: 1837 - 1841
Interfacial reaction between Sn-Bi alloy and Ni substrate J. WangH. S. LiuZ. P. Jin OriginalPaper Pages: 1842 - 1847
Microstrip antenna on a high dielectric constant substrate: BaTiO3 (BTO)-CaCu3Ti4O12(CCTO) composite screen-printed thick films P. B. A. FechineA. TávoraA. S. B. Sombra OriginalPaper Pages: 1848 - 1856
Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly O. NousiainenJ. PutaalaJ. Vähäkangas OriginalPaper Pages: 1857 - 1865
Insulator-to-metal phase transformation of VO2 films upon femtosecond laser excitation S. LysenkoV. VikhninH. Liu OriginalPaper Pages: 1866 - 1872
Effect of thermal cycling on the growth of intermetallic compounds at the Sn-Zn-Bi-In-P lead-free solder/Cu interface Guohai ChenXiaoyan LiJusheng Ma OriginalPaper Pages: 1873 - 1878
Intergrowth mechanism of silicon nanowires and silver dendrites T. QiuX. L. WuPaul K. Chu OriginalPaper Pages: 1879 - 1884
Effect of Cu additives on Sn whisker formation of Sn(Cu) finishes H. J. KaoW. C. WuC. Y. Liu OriginalPaper Pages: 1885 - 1891
Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test Chang-Lin YehYi-Shao Lai OriginalPaper Pages: 1892 - 1901
Role of shape-memory alloy reinforcements on strain evolution in lead-free solder joints I. DuttaD. PanS. Harris OriginalPaper Pages: 1902 - 1913