Proximal probe characterization of nanoscale charge transport properties in Co/SiO2 multilayer structures D. M. SchaadtE. T. YuA. E. Berkowitz Regular Issue Paper Pages: 1299 - 1303
Chemical vapor deposition of B12As2 thin films on 6H-SiC R. H. WangD. ZubiaS. D. Hersee Regular Issue Paper Pages: 1304 - 1306
The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints J. SigelkoS. ChoiJ. P. Lucas Regular Issue Paper Pages: 1307 - 1311
Mechanistic study of borosilicate glass growth by low-pressure chemical vapor deposition from tetraethylorthosilicate and trimethylborate D. M. HansenD. ChartersT. F. Kuech Regular Issue Paper Pages: 1312 - 1318
Effect of copper and chlorine on the properties of SiO2 encapsulated polycrystalline CdSe films R. M. LangfordM. J. LeeT. Tate Regular Issue Paper Pages: 1319 - 1327
Interfacial reactions between In 10Ag solders and Ag substrates Y. M. LiuT. H. Chuang Regular Issue Paper Pages: 1328 - 1332
Electrochemical capacitance voltage profiling of the narrow band gap semiconductor InAs V. GopalE. -H. ChenJ. M. Woodall Regular Issue Paper Pages: 1333 - 1339
Al, B, and Ga ion-implantation doping of SiC Evan M. HandyMulpuri V. RaoT. Venkatesan Regular Issue Paper Pages: 1340 - 1345
Modulation spectroscopy study of a strained layer GaAs/GaAsP multiple quantum well structure L. MalikovaFred H. PollakAlexander Korotcov Regular Issue Paper Pages: 1346 - 1350
Charge accumulation of quantum dots at room temperature C. E. StutzQianghua XieJ. L. Brown Letter Pages: L29 - L31